KESTER 958 Soldering Flux

Harmonization Code : 29051200 |   Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)
Main features
  • Excellent for bare copper applications
  • Conformal coating compatible
  • Improves soldering performace

Product Description

Kester 958 is a no-clean, non-corrosive liquid flux specifically designed for wave soldering of conventional and surface mount circuit board assemblies. It delivers excellent soldering performance while leaving boards clean and dry, ensuring compatibility with post-process steps.

Product Key Features

  • Leaves virtually no residue after soldering; boards exit wave solder machine dry and cosmetically clean
  • Prevents interference with electrical testing and post-solder processes
  • Non-corrosive and non-conductive
  • Works well with most conformal coating products

Applications

  • Ideal for through-hole components
  • Bare copper PCBs with OSP coating
Product Family
AP-958  
1-Gallon Container

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Solids 2.7 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 0.806

Additional Information

Flux Application

958 can be applied to circuit boards by a spray, foam or dip process. Flux deposition should be 120 to 240 µg of solids/cm² (750 to 1500 µg of solids/in²). An air knife after the flux tank is recommended to remove excess flux from the circuit board and prevent dripping on the preheater surface for the Foam and Dip process.