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- Kester K100LD Lead-Free Solder Wire
Kester K100LD Lead-Free Solder Wire
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- Eutectic Sn/Cu alloy
- Controlled metallic dopants
- Refined grain structure
Product Description
KESTER K100LD is a eutectic Tin/Copper alloy engineered with controlled metallic dopants to refine the solder joint’s grain structure and reduce copper dissolution in the solder pot. This advanced formulation virtually eliminates common defects such as icicling and bridging. Its improved grain structure also produces noticeably shinier solder joints compared to traditional lead‑free alternatives.
Product Key Features
- Eutectic Sn/Cu Alloy: Provides consistent melting behavior and reliable soldering performance.
- Controlled Metallic Dopants: Reduces copper dissolution, extending solder pot life and maintaining alloy integrity.
- Refined Grain Structure: Enhances joint appearance and mechanical reliability.
Applications
- Wave Soldering Processes in both consumer and industrial electronics
- Selective Soldering Systems requiring stable, low‑defect alloys
Technical Specifications
| Thermal Properties | |||||
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| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 64 W/m.K | ||||
| Mechanical Properties | |||||
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