LOCTITE ABLESTIK NCF 234

Harmonization Code : 3919.90.80.99 | Polyacrylic plates / sheets / film / tape / strip, self-adhesive, in rolls

Main features

Non-conductive Underfill Film
Enable fine pitch, narrow gap Cu Pillar
Pb-free & low κ

Product Description

LOCTITE ABLESTIK NCF 234 transparent film is specially formulated for Pb free, low κ, thin gap, large and thin die used in advance flip chip applications. NCF 234 is suitable for die to die, die to wafer (TSV) or die to substrate applications.

Specifications
Additional Information

Technical Specifications

General Properties

Film Thickness

Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.

34 µm

Shelf Life
Shelf Life @ 5°C	180 days

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

105 °C

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	42 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	138 ppm/°C