Applications for solder spheres

Applications for Solder spheres

A sol­der sphere is a ball of sol­der that ensures the bond between the chip pack­age and the print­ed cir­cuit board.

CAPLINQ takes pride in offer­ing one of the high­est qual­i­ty sol­der spheres at some of the market’s best rates.

We not only offer a wide range of tin and lead and lead-free sol­der spheres but pro­vide you with the widest range of sol­der balls with diam­e­ter from 60 microns to 890 microns. The two types of sphere pro­vid­ed by us are Lead-Free Spheres and Tin Spheres.

After many years of test­ing, the semi­con­duc­tor indus­try has decid­ed to set­tle for SAC alloys for the lead-free prod­ucts. So, not only our spheres are high-tech, but they are made from unique spray­ing tech­nol­o­gy that gives excep­tion­al pro­duc­tiv­i­ty.

Read here more about the appli­ca­tion of sol­der spheres.

  • Sol­der spheres, both tin and lead-free are most­ly used in the semi­con­duc­tor mate­ri­als indus­try.
  • The pure tin sphere is also used for sev­er­al appli­ca­tions, and the most impor­tant of all is the elec­tro­plat­ing. These spheres con­sist of 99.9928% of tin that makes them a proven choice for coat­ing of leads. More­over, they can also be used for ter­mi­nals as it enables the drop for the devices that use the lead alloy plat­ing.
  • The eutec­tic tin spheres are best used for the CSA and BGA com­po­nents.
  • The lead-free spheres have excel­lent fatigue resis­tance and are best suit­ed for sol­der joint reli­a­bil­i­ty. More­over, the eutec­tic lead-free ones give you the high­est joint reli­a­bil­i­ty.

Why CAPLINQ for solder spheres?

With our com­bi­na­tion of high-tech­nol­o­gy and pro­duc­tiv­i­ty, CAPLINQ strives to offer you the best val­ue for your prod­uct.

We also pro­vide sol­der spheres that are packed into jars with nitro­gen to help the semi­con­duc­tor pack­ag­ing indus­try. Fur­ther­more, we do not repack them, so the jars you receive have nev­er been opened, thus ensur­ing the opti­mum qual­i­ty for it. Each jar has a clear label that spec­i­fies the diam­e­ters, quan­ti­ty, alloy type, and the date of man­u­fac­ture.

We also offer sol­der sphere tape and reel pack­ag­ing that is suit­able for flip chip and BGA pack­ag­ing tech­niques. It is com­pat­i­ble with all exist­ing place and picks feed­ers.

For more infor­ma­tion on sol­der spheres, you can vis­it www.caplinq.com. You can also con­tact us if you have any oth­er queries or ques­tions regard­ing the CAPLINQ’s sol­der­ing mate­ri­als.

About Renee de Schepper

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