LOCTITE ABLESTIK 8322A

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • Minimal resin bleed
  • Large device bonding
  • Accurate bondline control

Product Description

This product has been discontinued since Q4 2021. If you are looking for alternatives you mights be interested in 2200D, QMI536NB or 8303A

LOCTITE® ABLESTIK 8322A adhesive is designed for medium die attach applications. Improvements in epoxy resin and adhesion technology were incorporated into this adhesive for maintaining significant bond strength after exposure to elevated temperatures and humidity.

LOCTITE® ABLESTIK 8322A is a snap curable epoxy with minimal resin bleed and low condensable volatiles. It is suitable for large device bonding with great resistance to delamination with excellent dispensability that is engineered for accurate bondline control.

Cure Schedule

  • Please consult the TDS for the Snap cure schedule.(60sec)
  • 30 minutes @ 175°C
Product Family
8322A  
5cc in 10cc Syringe

No longer available

This product is no longer available from CAPLINQ. Please contact us so we can recommend an alternative product.

Technical Specifications

General Properties
Density (g) 2.8 g/cm3
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
24 hours
Shelf Life
Shelf Life @ -40°C 365 days
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2.4x100 Ohms⋅cm
Chemical Properties
Moisture absorption 0.75 %
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
20 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
5 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
10 ppm
Physical Properties
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
4
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
9,000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
30 °C
Specific Heat Capacity
Specific Heat Capacity
Specific heat capacity is the amount of heat energy required to raise the temperature of a substance per unit of mass. The specific heat capacity of a material is a physical property. It is also an example of an extensive property since its value is proportional to the size of the system being examined.
1.3 J/(g⋅°C)
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.7 W/m.K
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
65 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
135 ppm/°C
Mechanical Properties
Shear strength
Shear Strength @250°C 1.9 N/mm2
Shear Strength @25°C 24 N/mm2
Tensile Modulus
Tensile Modulus @-65°C 1,800 N/mm2
Tensile Modulus @150°C 11 N/mm2
Tensile Modulus @250°C 11 N/mm2
Tensile Modulus @25°C 1,600 N/mm2

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