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LOCTITE ABLESTIK ABP 8303A silver filled, conductive die attach adhesive is recommended for use in bonding integrated circuits and components to metal substrates. It offers low outgassing, minimal resin bleed out and high die shear strength Its moderate modulus, high adhesion and low stress enable robust bonding of medium/large sized dice on a wide variety of metal surfaces, including bare copper (Cu), Ag and PPF.
LOCTITE ABLESTIK ABP 8303A is a Bismaleimide/Hybrid adhesive, particularly suitable for packages in which tight control of resin bleed out is required. The material is hydrophobic and stable at high temperatures. It is ideal for large die sizes and is typically used on QFP, QFN and other metal leadframe packages.