Product Description
LOCTITE ABLESTIK 2200D electrically conductive die attach adhesive is designed for high reliability leadframe packaging applications. This hybrid, low stress product can be snap cured and shows excellent how/wet adhesion on metal leadframes.
LOCTITE ABLESTIK 2200D offers low moisture absorption and low modulus that contribute to its improved JEDEC performance.
Cure Schedule
- Fast Cure Oven: 15 to 30 minutes @ 175°C
- Hot Plate Spot Cure: 30 seconds @ 200°C