Specialty Chemicals, Adhesives & Plastics
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LOCTITE® ABLESTIK QMI529HT-2A1 conductive die attach adhesive has been formulated for use in high throughput die attach applications. A package or device using this material will have a high resistance to delamination and popcorning after multiple exposures to Pb-free solder reflow temperatures. This product has 1 mil spacers.
LOCTITE® ABLESTIK QMI529HT-2A1 may be covered by patent 5,716,034 and by one or more pending patent applications. This BMI/Acrylate die attach adhesive is typically used on a wide variety of metals and ceramic surfaces, Copper, Silver Plated Copper, Preplated leadframes (NiPdAu) and Alloy 42.