Integrated circuits
SOP, QFP, QFN, BGA, SIP, POP
Leadframe and Laminate
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Integrated Circuits
Integrated circuits
Molding compounds for Leadframe Integrated Circuits
| Package | Product | Key Feature |
|---|---|---|
| SOP | Hysol GR530 | JEDEC MSL3; price-advantaged SOP platform. |
| Hysol GR510 | JEDEC MSL3; good workability and broad process window for SOP. | |
| Hysol GR510HP | JEDEC MSL3; positioned for power IC and MOSFET devices on leadframe. | |
| Hysol GR710 | JEDEC MSL3; excellent wire sweep control and stable molding performance. | |
| Hysol GR700 | JEDEC MSL1; high reliability leadframe platform with strong anti-delamination behavior. | |
| LINQSOL EMC-7142 | Halogen-free leadframe EMC option for SOP; designed for stable moldability and reliability positioning. | |
| QFP | Hysol GR510 | JEDEC MSL3; good workability for QFP. |
| Hysol GR700 | JEDEC MSL3; positioned for small-outline QFP packages. | |
| Hysol GR900 | JEDEC MSL3; positioned for bigger-outline QFP packages. | |
| LINQSOL EMC-9012 | Halogen-free EMC option for QFP; balanced flowability and reliability positioning. | |
| LINQSOL EMC-G833 | Halogen-free EMC option for QFP; positioned for thin, high-density designs needing flow and warpage control. | |
| QFN/DFN | Hysol GR900 | JEDEC MSL1; superior warpage performance and high reliability positioning for QFN/DFN. |
| LINQSOL EMC-9012 | Halogen-free EMC option for QFN/DFN; balanced moldability and reliability positioning. | |
| LINQSOL EMC-G833 | Halogen-free EMC option for QFN/DFN; positioned for thin packages requiring good flow and warpage control. |
All products are "Green"
Molding Compounds for Laminate Integrated Circuits
| Package | Product | Key Features |
|---|---|---|
| MCM | Hysol GR9851MTL | Green epoxy molding compound listed for MCM (laminate IC) applications. |
| PoP / Sensor | Hysol GR9810-1P | Sensor-focused black EMC with warpage and wire sweep control (halogen-free / green). |
| Hysol GR9810-1PF | PoP / SCSP-capable black EMC emphasizing ATF resistance, ultra-long flow, and low warpage (halogen-free / green). | |
| LINQSOL EMC-9070 | QFN/DFN-oriented black EMC targeting JEDEC MSL 1 @ 260°C via low stress, low warpage, and low moisture absorption (halogen-free). | |
| LINQSOL EMC-G208 | Halogen-free EMC engineered for thin, high-density packages; high Tg (185°C), high filler/low CTE matrix, excellent flow, designed to meet JEDEC MSL 3. | |
| BGA / LGA | Hysol GR910C | Black semiconductor-grade EMC for memory BGA/LGA; 75 µm cut spherical silica, high fluidity, low shrinkage for warpage control (halogen-free). |
| Hysol GR910C4 | Improved GR910C variant; smaller filler cut size (53 µm) and lower smile warpage for tighter-gap designs. | |
| Hysol GR910K | Black EMC designed for memory BGA/LGA with high fluidity and low shrinkage for warpage control (halogen-free). | |
| Hysol GR910LB | High-performance EMC positioned for BGA thin form factor card use; emphasizes protection and reliability for ultra-compact packages (halogen-free; high fluidity). | |
| LINQSOL EMC-G845 | Halogen-free EMC for thin, high-density packages (QFN/QFP focus) with emphasis on flowability and low water absorption; aligned to JEDEC MSL 3 reliability. | |
| LINQSOL EMC-G836 | Halogen-free EMC engineered for QFN/QFP and thin high-density packages (including BGA TF cards); high spiral flow and wide gel time window; targets JEDEC MSL 3. | |
| MUF / SiP | Hysol GR920 | Molded underfill series for BGA and flip-chip use; positioned for narrow gap fill and strong warpage control. |
| LINQSOL EMC-9023 | Molded underfill (MUF) epoxy EMC developed for FCBGA, FCCSP, and SiP; excellent flowability plus low modulus (low stress), UL 94 V-0, low ionic content; K and E variants available. |
All products named as "GR and "G" are green and non-greeem for "MG".
