Integrated circuits
SOP, QFP, QFN, BGA, SIP, POP
Leadframe and Laminate
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Integrated Circuits
Integrated circuits
Molding compounds for Leadframe Integrated Circuits
| Package | Product | Key Feature |
| SOP | Hysol GR 430 | Superior Moldability; Lower cost |
| Hysol GR 530 | Up to MSL3; Lower cost | |
| Hysol GR 510 | Up to MSL3; Good workability | |
| Hysol GR 510-HP | Up to MSL3; Good workability; Excellent electrical performance at high working temperature(180 degree C) | |
| Hysol GR 510F | Low cost; Good reliability; Good anti-delamination | |
| Hysol GR 700 | High adhesion; Low stress; Low moisture absorption; High anti-delamination; High reliability | |
| Hysol GR 710 | Low stress; High reliability; High anti-delamination; Superior electrical performance | |
| QFP | Hysol GR 510 | Up to MSL3; Good workability |
| Hysol GR 700 | Up to MSL1; High adhesion; Low stress; Low moisture absorption; High anti-delamination; High reliability | |
| Hysol GR 710 | Up to MSL3; Low stress; High reliability; High anti-delamination; Superior electrical performance | |
| QFN/DFN | Hysol GR 900 | Good workability; Superior Warpage performance; Good delam & reliability performance |
| BGA/Sensor | Hysol GR 9810-1P | Superior Warpage performance; Up to MSL1 |
| Hysol GR 9810-1PLA | Superior Warpage performance; Up to MSL2; Low Alpha | |
| Hysol GR 910 | Superior Warpage performance; Low wire sweep; Good anti-delamination; Good reliability |
All products are "Green"
Molding Compounds for Laminate Integrated Circuits
| Package | Product | Key Feature |
| MCM | Hysol GR 9851MTL | Lower cost; MCM application |
| SIP/POP | Hysol GR 9810-1P | Superior Warpage performance; Up to MSL2; |
All products are "Green"
