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Hysol GR9810-1P is a heat curable, state of the art, black, semiconductor epoxy molding compound developed to meet the stringent encapsulation requirements of package on package (POP and SCSP). It has been formulated to provide the best possible moldability and as wide a molding latitude as possible. It is a Green, halogen free product with, excellent dimensional stability, low shrinkage and High Tg.
Hysol GR9810-1P and its related product GR9810-1PF (with a 45 micron filler cut) offer a new technology platform on which Hysol develops epoxy mold compounds for high reliability sensors and modules such as humidity and temperature sensors. This is done by optimizing the filler particle size density with a maximum PSD of 75um (-1P) or 45um (in the case of GR9810-1PF) filler cut and by using a low viscosity resin and latent catalyst for ultra long flow that makes this product optimal for less wire sweep.
Hysol GR9810-1P is developed for advanced reliability control. The goal of this technology platform is to introduce an epoxy mold compound capable of passing MSL1 260°C on some devices and at least MSL3 260°C on a stacked CSP (PoP) devices. This was achieved by improving the adhesion promoter and toughening system and using a spherical high filler loading (85% by weight) for lower moisture uptake that leads to better MSL performance.
Advance warpage control
Warpage is always a problem with MAP-molded or large over-molded devices. GR9810-1P achieved warpage control by:
Digital humidity and temperature sensors
Sensor devices (such as our Smartlinq USB Temperature Data Loggers or our other Temperature Data Loggers) require precise, reliable and cost-effective humidity measurement and control. This allows them to be used reliability and effectively in a wide variety of applications such as consumer goods, automotive, logistics and HVAC applications. As such, GR9810-1P: