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Hysol GR9810-1P | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • For sensors & modules
  • Advanced warpage control
  • Reliability and wire sweep control

Product Description

Hysol GR9810-1P is a heat curable, state of the art, black, semiconductor epoxy molding compound developed to meet the stringent encapsulation requirements of package on package (POP and SCSP). It has been formulated to provide the best possible moldability and as wide a molding latitude as possible. It is a Green, halogen free product with, excellent dimensional stability, low shrinkage and High Tg.

Hysol GR9810-1P and its related product GR9810-1PF (with a 45 micron filler cut) offer a new technology platform on which Hysol develops epoxy mold compounds for high reliability sensors and modules such as humidity and temperature sensors. This is done by optimizing the filler particle size density with a maximum PSD of 75um (-1P) or 45um (in the case of GR9810-1PF) filler cut and by using a low viscosity resin and latent catalyst for ultra long flow that makes this product optimal for less wire sweep.

Hysol GR9810-1P is developed for advanced reliability control. The goal of this technology platform is to introduce an epoxy mold compound capable of passing MSL1 260°C on some devices and at least MSL3 260°C on a stacked CSP (PoP) devices. This was achieved by improving the adhesion promoter and toughening system and using a spherical high filler loading (85% by weight) for lower moisture uptake that leads to better MSL performance.

Cure time

  • 70 - 90 seconds @ 175ºC (Conventional)
  • 50 - 70 seconds @ 175ºC (Automold)

Post Cure

  • 2 - 6 hours @ 175ºC 
Product Family
GR9810-1P  
Pellet
14 mm
7 gr 4.4 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
Color
Color
The color
Black
Filler Content 85 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.95
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 365 days
Physical Properties
Spiral Flow @ 175°C 150 cm
Chemical Properties
Moisture absorption 0.27 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 220°C
Flexural Modulus @ 220°C
Flexural Modulus taken at 220°C
230 N/mm2
Flexural Modulus @ 25°C 2100 N/mm2
Flexural Strength
Flexural Strength @ 240°C
Flexural Strength @ 240°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 240°C
2 N/mm2
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
14 N/mm2
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C 85
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
11 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
50 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 32 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
170 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.9 W/m.K
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V-0
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F (Automold) 50 - 70 s
Mold Temperature 160 - 190 °C
Preheat Temperature 80 - 90 °C
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 2 - 6 hrs
Transfer Pressure 30 - 60 kg/cm2
Transfer Time 15 - 20 s

Additional Information

Advance warpage control

Warpage is always a problem with MAP-molded or large over-molded devices. GR9810-1P achieved warpage control by:

  • Using a multifunctional resin hardener system with high Tg & high cross-linking degree) with special toughening system
  • Using a high filler loading for low CTE to minimize thermal mismatch
  • Using a high performance stress modifier to reduce internal stress

Digital humidity and temperature sensors

Sensor devices (such as our Smartlinq USB Temperature Data Loggers or our other Temperature Data Loggers) require precise, reliable and cost-effective humidity measurement and control. This allows them to be used reliability and effectively in a wide variety of applications such as consumer goods, automotive, logistics and HVAC applications. As such, GR9810-1P:

  • Is used in variety of applications including mobile devices
  • Passes 160ºC high temperature operating tests
  • Passes MSL1& 1000 TC customer reliability
  • Has the best adhesion on PPF lead frames
  • Is compatible with Cavity and Film Assisted Molding process

 

 GR9810-1PF shows good oil resistance and temperature recycling performance

 

 Additional data