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Sensors

Sensors

MEMS, Cameras, Fingerprints

Humidity and temperature sensors

Humidity and Temperature sensors

Humidity and temperature sensors range from common, consumer good devices that can be applied to a huge variety of industries and supply chains to industrial equipment with . They (obviously) measure the temperature and humidity of spaces, packages and shipments and their main difference is the accuracy, tolerance and operating conditions. Different sensors require different setups and BOMs and we can help you with packaging all of them. From the cheapest commodity sensor to the one that should withstand cryogenic or other extreme conditions.

High reliability sensors require molding compounds with good adhesion and reduced moisture uptake in order to increase their MSL performance. Catalytic to this point is the high filler loading that enables a lower moisture uptake.
Low warpage can be achieved by the usage of multifunctional resin hardener system with high Tg & high cross-linking degrees and with high filler loading for low CTE to minimize thermal mismatch. Finally, high performance stress modifiers can reduce internal stress.

Application considerations

  • Used in variety of applications including mobile devices 
  • Passing 160°C high temperature operating test 
  • Passing MSL1 & 1000 TC customer reliability 
  • Best adhesion on PPF lead frame 
  • Compatible with cavity and film assisted molding process
SHT 21 | SENSIRION Humidity Temperature Sensor | SOS electronic
 

Molding compound solutions for humidity and temperature sensors

GR9810-1P has been successfully applied in our customers’ sensor products. Embedded in a reflow solderable dual-flat no-leads (DFN) package of 3 × 3 × 1.1 mm3, the sensor contains a capacitive-type humidity sensor and a band-gap temperature sensor. It makes for a reliable and cost effective humidity sensor that controls a variety of applications such as consumer goods, automotive and HVAC applications.

 

Property / Product

Unit

Hysol
GR9810-1P

Hysol
GR9810-1PF

UNCURED PROPERTIES

 

   

Hot Plate Gel time,  @ 175°C

s

32

40

Spiral Flow @ 175°C

in

60

67

Flammability

 

V-0

V-0

Halogen-free (Green)

 

Shelf Life @ 5°C

 months

12

12

TYPICAL CURED PROPERTIES

 

   

Specific Gravity, g/cc

g/cc

1.95

1.95

Glass Transition Temperature

°C

170

184

Coefficient of Thermal Expansion (CTE)
    Alpha1
    Alpha2


ppm/C
ppm/C


11
50


11

40

Flexural Strength, @25°C

MPa

137

119

Flexural Strength, @240°C

MPa

19.6

19.6

Flexural Modulus (E), @25°C

GPa

20.6

20.6

Flexural Modulus (E), @220°C

GPa

2.26

2.26

Moisture Absorption, 24hr PCT

%

0.27

-

Mold Shrinkage, as molded

%

0.10

0.15

Thermal Conductivity

W/mK

0.9

-

Summary



  • Green Product

  • High Tg and low shrinkage

  • Long spiral flow and advanced warpage control

  • Excellent dimensional stability 

  • Excellent room temperature working life