Hysol GR910-C | Black Epoxy Mold Compound
- Halogen free
- High fluidity
- Designed for BGA/LGA
Hysol GR910 C is a black, epoxy, semiconductor grade molding compound designed for Memory ball grid arrays (BGA) and land grid arrays (LGA). This spherical silica filled product (cut size of 75um), offers high fluidity and low shrinkage that aids a very advanced warpage control.
Hysol GR910 C is a halogen free, environmentally friendly compound with good electrical performance that meets UL 94 V-0 Flammability at 1/8 inch thickness. You might also be interested in GR910-C4 an identical product with even lower smile shrinkage.
| Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
|Spiral Flow @ 175°C
| Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
| Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
|40 - 85 kg/cm2
|7 - 15 s