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Hysol GR910 C is a black, epoxy, semiconductor grade molding compound designed for Memory ball grid arrays (BGA) and land grid arrays (LGA). This spherical silica filled product (cut size of 75um), offers high fluidity and low shrinkage that aids a very advanced warpage control.
Hysol GR910 C is a halogen free, environmentally friendly compound with good electrical performance that meets UL 94 V-0 Flammability at 1/8 inch thickness. You might also be interested in GR910-C4 an identical product with even lower smile shrinkage.