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Hysol GR910-C4 is an improved version of GR910-C. This black, epoxy, semiconductor grade molding compound is designed for Memory ball grid arrays (BGA) and land grid arrays (LGA). Its small spherical silica cut (cut size of 53um), offers high fluidity and low smile shrinkage that aids a very advanced warpage control.
There are two main differences between Hysol GR910-C4 and C.
Hysol GR910-C4 is a halogen free, environmentally friendly compound with good electrical performance that meets UL 94 V-0 Flammability at 1/8 inch thickness.