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Hysol GR910-C4 |Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • Improved version of GR910-C
  • Lower smile warpage
  • Smaller cut size (53um)

Product Description

Hysol GR910-C4 is an improved version of GR910-C. This black, epoxy, semiconductor grade molding compound is designed for Memory ball grid arrays (BGA) and land grid arrays (LGA). Its small spherical silica cut (cut size of 53um), offers high fluidity and low smile shrinkage that aids a very advanced warpage control.

There are two main differences between Hysol GR910-C4 and C.

  1. The first one is the filler cut size: C4 cut size is 53microns; C cut size is 75 microns. When a package design has very narrow gaps (100microns), C4 will be a better candidate and have better filling performance than C.
  2. The second and maybe most important difference between them is the warpage performance. C4 has smaller smile warpage than C with everything that entails.

Hysol GR910-C4 is a halogen free, environmentally friendly compound with good electrical performance that meets UL 94 V-0 Flammability at 1/8 inch thickness.

Product Family
GR910C4  
Pellet
14 mm
4.4 gr
10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications

General Properties
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2
Color
Color
The color
Black
Filler Content 88 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 183 days
Chemical Properties
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 168h @ 85ºC | 85% RH 0.3 %
Mechanical Properties
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
140 N/mm2
Flexural Modulus
Flexural Modulus @ 25°C 20000 N/mm2
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.0x1016 Ohms⋅cm
Thermal Properties
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 44 s
Spiral Flow
Spiral Flow @ 175°C 170 cm
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
130 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1 W/m.K
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
28 ppm/°C
Curing Conditions
Preheat Temperature 70 - 90 °C
Mold Temperature 170 - 185 °C
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 7 - 15 s
Curing Time
Curing Time @ 175°C / 347°F 100 - 150 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs