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Hysol GR9810-1PF | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Ultra long flow
  • Ultra low warpage
  • ATF Resist

Product Description

Hysol GR9810-1PF is a heat curable, state of the art, black, semiconductor epoxy molding compound developed to meet the stringent encapsulation requirements of package on package (POP and SCSP). It is a Green, halogen free product with, excellent dimensional stability, very low mold shrinkage and High Tg. Its chemistry allows for properties that go far beyond the "Standard Green" compound ranges.

Hysol GR9810-1PF has a 45um spherical filler (86% weight) and offers a new technology platform on which Hysol develops epoxy mold compounds for high reliability sensors and modules such as humidity and temperature sensors. This is done by optimizing the filler particle size density and by using a low viscosity resin and latent catalyst for ultra long flow that makes this product optimal for less wire sweep.

Hysol GR9810-1PF is developed for advanced reliability control. The goal of this technology platform is to introduce an epoxy mold compound capable of passing MSL1 260°C on some devices and at least MSL3 260°C on a stacked CSP (PoP) devices. The benefits do not stop here since this product is resistant to ATF (Automatic transmission fluid) and exhibits ultra low warpage making it an excellent choice for automotive packages.

Cure time

  • 3min @ 177ºC 

Post Cure

  • 4 - 6 hours @ 175ºC 
Product Family
GR9810-1PF  
Pellet
14 mm
4.4 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 - 12 weeks Shipping in 8 - 12 weeks

Technical Specifications

General Properties
Color
Color
The color
Black
Filler Content 86 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.95
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 365 days
Chemical Properties
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 168h @ 85ºC | 85% RH 0.40 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 220°C
Flexural Modulus @ 220°C
Flexural Modulus taken at 220°C
230 N/mm2
Flexural Modulus @ 25°C 2100 N/mm2
Flexural Strength
Flexural Strength @ 240°C
Flexural Strength @ 240°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 240°C
2 N/mm2
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
12.1 N/mm2
Molded Shrinkage 0.15 %
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
11 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
40 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 40 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
184 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.9 W/m.K
Spiral Flow
Spiral Flow @ 175°C 170 cm
UL94 Rating
UL94 @ 1/4 inch V-0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F (Automold) 50 - 70 s
Mold Temperature 175 °C
Transfer Pressure 90 kg/cm2
Transfer Time 15 - 20 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 hrs

Additional Information

Advance warpage control

Warpage is always a problem with MAP-molded or large over-molded devices. GR9810-1PF achieved warpage control by:

  • Using a multifunctional resin hardener system with high Tg & high cross-linking degree) with special toughening system
  • Using a high filler loading for low CTE to minimize thermal mismatch
  • Using a high performance stress modifier to reduce internal stress

Digital humidity and temperature sensors

Sensor devices (such as our Smartlinq USB Temperature Data Loggers or our other Temperature Data Loggers) require precise, reliable and cost-effective humidity measurement and control. This allows them to be used reliability and effectively in a wide variety of applications such as consumer goods, automotive, logistics and HVAC applications. As such, GR9810-1PF:

  • Is used in variety of applications including mobile devices
  • Passes 160ºC high temperature operating tests
  • Passes MSL1& 1000 TC customer reliability
  • Has the best adhesion on PPF lead frames
  • Is compatible with Cavity and Film Assisted Molding process