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Hysol GR9810-1PF is a heat curable, state of the art, black, semiconductor epoxy molding compound developed to meet the stringent encapsulation requirements of package on package (POP and SCSP). It is a Green, halogen free product with, excellent dimensional stability, very low mold shrinkage and High Tg. Its chemistry allows for properties that go far beyond the "Standard Green" compound ranges.
Hysol GR9810-1PF has a 45um spherical filler (86% weight) and offers a new technology platform on which Hysol develops epoxy mold compounds for high reliability sensors and modules such as humidity and temperature sensors. This is done by optimizing the filler particle size density and by using a low viscosity resin and latent catalyst for ultra long flow that makes this product optimal for less wire sweep.
Hysol GR9810-1PF is developed for advanced reliability control. The goal of this technology platform is to introduce an epoxy mold compound capable of passing MSL1 260°C on some devices and at least MSL3 260°C on a stacked CSP (PoP) devices. The benefits do not stop here since this product is resistant to ATF (Automatic transmission fluid) and exhibits ultra low warpage making it an excellent choice for automotive packages.
Advance warpage control
Warpage is always a problem with MAP-molded or large over-molded devices. GR9810-1PF achieved warpage control by:
Digital humidity and temperature sensors
Sensor devices (such as our Smartlinq USB Temperature Data Loggers or our other Temperature Data Loggers) require precise, reliable and cost-effective humidity measurement and control. This allows them to be used reliability and effectively in a wide variety of applications such as consumer goods, automotive, logistics and HVAC applications. As such, GR9810-1PF: