Hysol GR9810-1PF | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Hysol GR9810-1PF | Black Epoxy Mold Compound

Main features

Ultra long flow
Ultra low warpage
ATF Resist

Product Description

Hysol GR9810-1PF is a heat curable, state of the art, black, semiconductor epoxy molding compound developed to meet the stringent encapsulation requirements of package on package (POP and SCSP). It is a Green, halogen free product with, excellent dimensional stability, very low mold shrinkage and High Tg. Its chemistry allows for properties that go far beyond the "Standard Green" compound ranges.

Hysol GR9810-1PF and its related product GR9810-1P offer a new technology platform on which Hysol develops epoxy mold compounds for high reliability sensors and modules. Key features of GR9810-1PF are summarized as below.

Reliability

Improved adhesion promoter and toughening system
High filler loading (>86%) for lower moisture uptake
Reduced moisture uptake for best MSL performance (MSL1-3)

Warpage Control

Multifunctional resin hardener system with high Tg
High cross-linking degree with special toughening system
High filler loading for low CTE to minimize thermal mismatch
High performance stress modifier to reduce internal stress

Wire Sweep Control

Optimized filler PSD with 75um (-1P) or 45um (-1PF) filler cut
Low viscosity resin and latent catalyst for ultra long flow

Hysol GR9810-1PF is developed for advanced reliability control. The goal of this technology platform is to introduce an epoxy mold compound capable of passing MSL1 260°C on some devices and at least MSL3 260°C on a stacked CSP (PoP) devices. The benefits do not stop here since this product is resistant to ATF (Automatic transmission fluid) and exhibits ultra low warpage making it an excellent choice for automotive packages. Check reliability test results and typical applications in automotive electronics.

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

86 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.95

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	365 days

Physical Properties

Spiral Flow @ 175°C

170 cm

Chemical Properties

Moisture absorption

0.40 %

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 220°C Flexural Modulus @ 220°C Flexural Modulus taken at 220°C	230 N/mm2
Flexural Modulus @ 25°C	2100 N/mm2

Flexural Strength
Flexural Strength @ 240°C Flexural Strength @ 240°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 240°C	2 N/mm2
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	12.1 N/mm2

Molded Shrinkage

0.15 %

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	11 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	40 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	40 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

184 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.9 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F (Automold)	50 - 70 s
Mold Temperature	175 °C

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	4 hrs

Transfer Pressure

90 kg/cm2

Transfer Time

15 - 20 s

Additional Information

GR9810-1PF For Automotive Electronics Application

GR9810-1PF shows high reliability, good oil resistance, and excellent temperature recycling performance. GR9810-1PF is highly suitable for automotive electronics encapsulation. The key application advantages of GR9810-1PF:

Under investigation in transmission control unit application to replace current complex sealed housing designs
Used in a variety of applications including mobile devices
Have high Tg (>180°C), low stress, and warpage control
Ensure long-term reliability against automotive fluids
Reduce footprint, space, weight, and cost

The ATF resistance results show no negative effect on Tg value and storage modulus of GR9810-1PF after 2 weeks ATF 140°C exposure.

GR9810-1PF ATF Resistance Test

GR9810-1P(F) Data Curves

Comparison with GR 9810-1P

Property / Product	Unit	Hysol GR9810-1P	Hysol GR9810-1PF
UNCURED PROPERTIES
Hot Plate Gel time, @ 175°C	s	32	40
Spiral Flow @ 175°C	in	60	67
Flammability		V-0	V-0
Halogen-free (Green)		✔	✔
Shelf Life @ 5°C	months	12	12
TYPICAL CURED PROPERTIES
Specific Gravity, g/cc	g/cc	1.95	1.95
Glass Transition Temperature	°C	170	184
Coefficient of Thermal Expansion (CTE) Alpha1 Alpha2	ppm/C ppm/C	11 50	11 40
Flexural Strength, @25°C	MPa	137	119
Flexural Strength, @240°C	MPa	19.6	19.6
Flexural Modulus (E), @25°C	GPa	20.6	20.6
Flexural Modulus (E), @220°C	GPa	2.26	2.26
Moisture Absorption, 24hr PCT	%	0.27	-
Mold Shrinkage, as molded	%	0.10	0.15
Thermal Conductivity	W/mK	0.9	-
Summary		Green Product High Tg and low shrinkage Long spiral flow and advanced warpage control Excellent dimensional stability Excellent room temperature working life