LINQSOL EMC-9070 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • MSL1 260°C
  • Designed for QFN and DFN packages
  • Moisture Corrosion Resistance

Product Description

LINQSOL EMC-9070 is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of quad-flat no-leads (QFN) and dual-flat no-leads (DFN). Once molded and post-mold cured, this product provides optimum protection and reliability for these semiconductor devices.

LINQSOL EMC-9070 is a spherical silica filled (89%) EMC, typically used for QFN and DFN packages. QFN and DFN packages are low-profile packages that are MAP molded. This means that the packages are molded together in one large mold and then separated by cutting through the entire package. Epoxy molding compounds made for these types of packages must have a low warpage, and EMC-9070 is no exception. This product is formulated to have very low internal stress to reduce warpage, as well as low moisture absorption to increase MSL performance.

Key Features:

  • JEDEC MSL 1 @260°C
  • Low CTE (8ppm) and mold shrinkage (<0.2%)
  • Low moisture absorption (0.33% after PCT 96hrs@121°C)
  • Halogen-free (contains no br, Sb, P, etc.)
  • REACH and RoHS compliant
  • UL 94 V-0 Flammability 

Application: QFN and DFN Packages

Product Family
14 mm
4.4 gr
10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
The color
Filler Content 89 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 183 days
Physical Properties
Spiral Flow @ 175°C 127 cm
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
4.1 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
6.7 ppm
Moisture absorption 0.33 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 26 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
160 N/mm2
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C 83
Molded Shrinkage 0.2 %
Water Extract Data
Water Extract Data
Water Extract Data, 20hrs water boil
pH of extract 6.8
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
30 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 35 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
126 °C

Additional Information

Epoxy Type - Biphenyl Biphenyl Biphenyl
Hardener Type - Hydrophobic Hydrophobic Hydrophobic
Flame Retardant - Metal Hydroxide Metal Hydroxide Metal Hydroxide
Filler Content % 89 86 86.5
Filler Sieved Size um 75 75 75
Specific Gravity - 2.01 1.96 1.98
Spiral Flow @175°C inches 50 79 54
Gel Time @175°C seconds 35 40 24
Glass Transition Temperature °C 126 126 126
CTE by TMA, α1 ppm/°C 8 13 11
CTE by TMA, α2 ppm/°C 30 45 39
Hot Hardness, 120 sec@175°C Shore D 83 79 85
Flexural Strength @25°C MPa 160 113 158
Flexural Modulus @25°C GPa 26 21 23
Moisture Absorption, PCT 96hrs@121°C % 0.33 0.40 0.40
Mold Shrinkage % <0.2 <0.3 <0.3

Ionic Impurities (20hrs @160°C)




















Comments   General product for most QFN packages Long spiral flow with good warpage control for large L/F and panel Short gel time with good warpage control for productivity