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Hysol GR900 Q1G2 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • Designed for DFN and small QFN packages
  • Excellent electrical capabilities
  • Compatible with Copper Wire

Product Description

Hysol GR900 Q1G2 is a similar but alternative version of Q1L4. While Q1L4 offers great HTRB performance, Q1G2 offers better electrical performance for DFNs and small QFNs. It is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of quad-flat no-leads (QFN) and dual-flat no-leads (DFN).

Hysol GR900 Q1G2 is a relatively softer, spherical silica filled (89%) high end epoxy, typically used for QFN and DFN packages. QFN and DFN packages are low-profile packages that are MAP molded. This means that the packages are molded together in one large mold and then separated by cutting through the entire package. Epoxy molding compounds made for these type packages, like Q1G2, must have a low warpage.

Hysol GR900 Q1G2 is an environmentally "green" halogen free product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. It offers good adhesion after MSL 3 and meets UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness. If you are not after the electrical performance, then by all accounts GR 900 Q1L4 will probably be the better option.

Product Family
GR900Q1G2  
Pellet
55 mm
85.9 gr
1 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications

General Properties
Color
Color
The color
Black
Filler Content 89 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 183 days
Chemical Properties
Extractable Ionic Content, after 20 hours
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
13 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
3 ppm
Mechanical Properties
Water Extract Data, 20hrs water boil
Water Extract Data, 20hrs water boil
Water Extract Data, 20hrs water boil
Conductivity 23 mmhos/cm
pH of extract 6.2
Flexural Modulus
Flexural Modulus @ 25°C 22646 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
158 N/mm2
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds 78
Molded Shrinkage 0.19 %
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
6 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
33 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 25 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
112 °C
Spiral Flow
Spiral Flow @ 175°C 137 cm
UL94 Rating
UL94 @ 1/8 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F 120 s
Mold Temperature 175 - 190 °C
Preheat Temperature 70 - 90 °C
Transfer Pressure 40 - 100 kg/cm2
Transfer Time 5 - 30 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs

Additional Information