ABchimie CIPEX40 Aqueous Base for PCB Cleaners

Harmonization Code : 2909.49.00 | Ethers, ether-alcohols, ether-phenols, etc., other than acyclic

Main features

Ready‑to‑use aqueous formulation
Low‑foaming chemistry
High cleaning efficiency

Product Description

ABchimie CIPEX 40 is a ready‑to‑use, low‑foaming aqueous cleaner formulated for the effective removal of flux residues and solder paste from printed circuit boards after reflow. Diluted to 20% active concentration, CIPEX 40 delivers high cleaning efficiency while remaining safe for a wide variety of PCB materials.

Designed for versatility, CIPEX 40 performs exceptionally well in both ultrasonic cleaning systems and pressure spray wash equipment. It is also suitable for manual cleaning, making it an excellent choice for maintaining reflow ovens, flux traps, and other production equipment.

Product Key Features

Ready‑to‑use aqueous formulation (pre‑diluted to 20%)
Low‑foaming chemistry suitable for multiple cleaning systems
High cleaning efficiency for flux residues and solder paste
Compatible with ultrasonic and pressure spray wash equipment
Can be used for manual cleaning of production equipment

Applications

Post‑reflow cleaning of printed circuit boards
Removal of solder paste and flux residues

Specifications
Additional Information

Technical Specifications

Thermal Properties
Boiling Point Boiling Point The amount of degree’s needed to reach in order to make the substance boil.	100 °C
Flash Point Flash Point The flashpoint of a solvent is the lowest possible temperature at which it can vaporize to form an ignitable vapor. Flashpoint is often confused with “autoignition temperature”, which is the temperature at which a solvent ignites without an ignition source.	115 °C
General Properties
Appearance Appearance Appearance at room temperature.	Yellow Liquid
Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.	1.01

Additional Information

Reflow is a process in electronics manufacturing where solder paste is heated to melt and form reliable electrical connections between components and the printed circuit board (PCB). After heating, the solder cools and solidifies, securing the components in place.

During reflow, flux from the solder paste leaves behind residues on the PCB. These residues can affect electrical performance, cause corrosion, or impact reliability over time. Cleaning removes these contaminants, ensuring optimal functionality, long-term reliability, and a clean final product.

Types of Cleaning

Why is PCB Cleaning Required?

After reflow soldering, the PCB (printed circuit board) is cleaned to remove any leftover flux and solder paste residues.

Even though the solder is solidified and the components are attached, flux residues can be sticky or corrosive, and over time they can:

Causes electrical leakage or short circuits
Promote corrosion on metal surfaces
Affect the board’s reliability and appearance

Using a cleaner like CIPEX 40 or 50, the PCB is washed to remove all residues and leave the board clean and ready for use or further assembly.

DIFFERENT TYPES OF PCB CLEANING

Spray Machine Cleaning

Uses pressurized jets of cleaning fluid to remove residues from surfaces and components. Effective for fast, uniform cleaning of larger areas and external parts.

Machine Online Cleaning

Cleaning is performed directly within the equipment without disassembly, allowing the system to remain in operation or quickly return to service. Ideal for minimizing downtime in continuous production environments.

Ultrasonic Machine Cleaning

Employs high-frequency sound waves in a liquid bath to create microscopic cavitation bubbles that dislodge contaminants. Perfect for precision cleaning of small or complex components with hard-to-reach areas.