ALPHA OM-338-PT Paste Solder Flux

Product Description

ALPHA OM‑338‑PT is a lead‑free, no‑clean solder paste designed for high‑yield SMT assembly and smooth transition from tin‑lead to lead‑free processes. It delivers tin‑lead–like performance with a wide processing window, excellent print consistency, and reliable reflow behavior across diverse board designs.

Optimized for ultra‑fine features (down to 11 mil squares) and high‑throughput production, OM‑338‑PT provides strong solder coalescence on CuOSP, excellent resistance to random and mid‑chip solder balling, and superior solder joint cosmetics. Enhanced formulation improves in‑circuit pin test yields versus ALPHA OM‑338 while maintaining high electrical reliability. IPC‑7095 Class 3 voiding and ROL0 classification support long‑term product reliability.

Product Key Features

• Lead‑free, no‑clean, halide‑free (ROL0) solder paste
• Broad process window for SnPb → lead‑free conversion
• Consistent printing down to 11 mil (0.28 mm) features
• High‑speed printing up to 150 mm/s (6 in/s)
• Meets IPC‑7095 Class 3 voiding
• Compatible with air or nitrogen reflow

Applications

• High‑volume SMT production
• Fine‑pitch and dense PCB assemblies