Transistors

MOSFETS, TOS and BJTS

Switches and Amplifiers

Metal Oxide Semiconductor FETS Insulated-Gate Bipolar Transistor (IGBT) Small Outline Transistors (SOT) Transistor Outline (TO)

Transistor Outline (TO)

TO-252, also known as DPAK, is a semiconductor package developed for surface mounting on circuit boards. It represents a surface-mount variant of TO-251 package, and smaller variant of the D2PAK package, also known as TO-263. DPAK is suitable for medium-power applications (reference values 80W*/60A), while D2PAK is for higher power application (reference values 100A).

A common Bill Of Materials would include a Ni plated copper leadframe, Pb solder die attach, Al wire for the intereconnects and a molding compound to keep it all together.

Typical Applications

The DPAK/D2PAK package is suitable for medium/high power applications designed for low on-resistance and high-speed switching MOSFETs, such as:

Motor drivers
Power supply circuits
DC-DC converters,
Consumer and automotive products.

Typical Reliability Test

JEDEC standard pre-conditioning except high temperature storage
85°C/85% RH, 168 hours, IR reflow 260°C 3X
H3TRB: 85°C/85% RH, 1000 hours
UHAST: 130°C/85% RH, 96 hours
Temperature Cycle: -55°C to 150°C, 1000 cycles
High Temp Storage: 150°C, 1000 hours

A great solution for the molding compound can be GR600. Hysol GR600 Series is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of power discrete semiconductor packages, such as DPAK, D2PAK, TO220 and TO251 packages. It has achieved commercial success with many uses on TO applications.

Hysol GR600 Epoxy Mold Compound Chemistry

EMC Chemistry	GR600SL2	GR600A	GR600	GR600-P1
Platform	TO252/251/263	TO252/251/263	TO252/251/263	TO252/251/263
Resin Type	EOCN + LWA-3	LWA-1 + LWA-2	LWA-1	MAR + Flexible
Hardener Type	PN + LWA-1	LWA-m	LWA-m	--
Filler Loading	85±1%	88±1%	88±1%	88±1%
Filler Type	Spherical + Angular	Spherical	Spherical	-
Catalyst	P/N	P/N	P/N	-
MSL Performance	MSL3 (Cu/Ag plating)	MSL3 (Cu/Ag plating)	MSL1 (Cu/Ag plating)	MSL1 (Cu/Ag plating)

Hysol GR600 Series Technical Specifications

Property / Product	Unit of Measure	GR600-SL2	GR600-A	GR600	GR600-P1
UNCURED PROPERTIES
Hot Plate Gel time, @ 175°C	s	25	41	28	38
Spiral Flow @ 175°C	in	32	53	32	25
Flammability		1/8’’ V-0	1/8’’ V-0	1/8’’ V-0	1/8’’ V-0	UL94 V-0
Halogen-free (Green)		✔	✔	✔	✔	Green product
TYPICAL CURED PROPERTIES
Specific Gravity, g/cc	g/cc	2.03	1.97	2.00	2.11
Glass Transition Temperature, TMA	°C	153	113	122	124
Coefficient of Thermal Expansion (CTE) Alpha1 Alpha2	ppm/C ppm/C	10 43	9.8 28	6.8 26	14 36	Low CTE
Viscosity, @175°C	Pa.s	TBD	14	25	29
Flexural Strength, @25°C	MPa	138	139	139	142
Flexural Modulus, @25°C	GPa	19.1	19.8	17.6	19.8	Low stress
Storage Modulus (DMA), @25°C	Gpa	26.1	24.7	27.0	25.8
Storage Modulus (DMA), @175°C	Mpa	2798	736	1273	1312
Storage Modulus (DMA), @260°C	MPa	923	599	897	863
Shore-D Hardness @ 90s, 175°C	-	84	75	83	80
Moisture Absorption, 24hr PCT	%	0.25	0.25	0.18	0.22	Low water absorption

TO-220 is a power package intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat.

TO-257 is a hermetically sealed metal package that is otherwise considered equivalent to TO-220.

Silicone Carbide TO Packages

TIMS are not the only product category that has to be "custom made" for power modules. High power requires not just dissipation but also thermally stable semiconductor materials that can withstand the rigourous thermal cycling requirements. These range from die attach, encapsulants and bonding wires to epoxy molding compounds.

Epoxy molding compounds such as the GR750 series and GR15F-MOD2C are made with power modules in mind. With exquisite thermal performance these compounds have a very high Glass transition temperature and easy pass HTRB tests while keeping high MSL levels. They are designed for high power devices with low moisture absorption requirements.

Epoxy Molding compounds application considerations:

Excellent Thermal Stability (Passes Thermal Cycling Test)
- High T_g as required
- Low weight loss by TGA test and low thermal expansion

Excellent Electrical Stability (Passes HTRB Test)
- Low ion content and low ionic mobility at high power condition
- Stable ionic conductivity and permittivity at high temperature condition;

Reliability for SiC MOSFETs Packages (Meets MSL Test Requirements)
- Low moisture absorption
- Low storage modulus
- Superior adhesion to lead frame
- Low Coefficient of Thermal Expansion (CTE)

Environmentally Friendly
- Green material without Br/Sb comply with RoHS;
- Suitable for halogen-free devices defined by the Jedec JS709B;

Epoxy Molding Compounds for TO Through Hole Devices

Package: TO92/TO126F
Non-Green	Green	Key feature
Hysol KL1000-3HL	Hysol KL-G200	Superior moldability; Lower cost
Hysol MG20KF	Hysol GR260-SL	Good delam &electrical performance
Hysol KL1000-T	－	No void; Better operability; High Electrical
－	Hysol GR30HT	HTRB / TCT/Good Ni adhesion

Package: TO220/247/3P
Non-Green	Green	Key feature
Hysol KL1000-TH	－	High adhesion; High reliability
Hysol KL1000-3HL	-	High adhesion; High reliability
Hysol MG20KF	Hysol GR260-SL(IMP3)	Lower cost; HAST 96h; HTRB 1000h; -TC500
Hysol MG15F-35A Hysol MG15F-0140	Hysol MG15F-MOD2C	Suit to high voltage application
－	Hysol GR300	HTRB 1000h; Excellent delamination on Ni-plating devices
－	Hysol GR15F-A	Good moisture resistance,Excellent electrical performances, good adhesion to Cu/Ag/Ni., high thermal stability
－	Hysol GR30	HTRB / TCT/Good Ni adhesion
－	Hysol GR30HT	Fast cure; Good Ni adhesion
－	Hysol GR400	Better operability; High Electrical
－	Hysol GR750	High Glass Transition Temperature, low moisture absorption, designed for high power SiC devices
－	Hysol GR750 X1/X2	High Glass Transition Temperature, low moisture absorption, designed for high power SiC devices
－	Hysol GR700 C4/P2	Low stress; Low moisture absorption; High reliability，designed for high power SiC devices

Package: TO 220F/3PF/126F
Non Green	Green	Key feature
Hysol KL5000HT	Hysol KL-G500HT	High thermal conductivity. (.2.0w/m.k, 0.3mm gap)
	Hysol KL-G500HT-ST	Fast cure/High TC/Excelletn WS control on Cu wire/PCT / HTRB / TCT
Hysol MG50HT	Hysol GR50HT	High thermal conductivity; Good electrical and delam performance (.2.0w/m.k, 0.3mm gap);HAST 96h; HTRB 1000h; TC1000c; Isolation test DC 4500V; Good workability
	Hysol GR50HT-ST	PCT 168h; TC1000c; HTRB1000h; Auto mold with Ni-plating lead

Epoxy Molding Compounds for TO Surface Mount Devices

Package: D2PAK (TO263)
Product	Key Feature
Hysol KL-G680H	MSL1 for Ni-plating lead; HTRB1000h; TC500c
Hysol GR300	HTRB 1000h; Excellent delamination on Ni-plating devices
Hysol GR600A	Ag/Cu plating lead & MSL3; Low moisture absorption; Excellent electrical performances
Hysol GR600-SL	Achieve JEDEC Level 3 on bare copper and nikel plated DPAK/D(2)PAK ; HTRB1000h; HAST96h
Hysol GR600	Achieve JEDEC Level 1 on bare copper and nikel plated DPAK/D(2)PAK ; Excellent electrical performances
Hysol GR710	Up to MSL3; Excellent electrical performances; HTRB1000h;
Hysol GR700	MSL1, excellent electrical performances；designed for high power SiC devices
Hysol GR750 X2	MSL1, excellent electrical performances；designed for high power SiC devices

		GR60HT	GR60PT	GR50HT	KL G500HT-ST	KL5000HT	GR760HT	GR770HT
Application		Power module		TO(Fullpack)			Under development
Leadframe Type		Cu,Ni,Ag	Cu,Ag	Cu/Ag	Cu/Ag	Cu/Ag	Cu, Ag, Ni	Cu, Ag, Ni
Filler Type	/	Silica	Silica	Silica	Silica	Silica	Silica/Alumina	Alumina
Filler shape	/	Angular	Angular	Angular	Angular	Angular	Angular/Spherical	Spherical
Filler Cut size	μm	150	150	150	175	150	150	75
Epoxy resin	/	EOCN+α1	EOCN/α2	EOCN+α1	EOCN+α1	EOCN+α1	EOCN+α1	EOCN+α1
Hardener	/	LWA	PN	PN	PN	PN	LWA	LWA
Flammability @ 1/8"		V-0	V-0	V-0	V-0	V-0	V-0	V-0
Spiral Flow @175°C	cm	58	89	46	41	51	51	64
Gel time(s) @175°C	S	35	34	30	23	20	40	30
Hot Hardness @175°C90S	/	80	80	73	80	84	80	74
CTE1	*E-5/℃	19	20	20	20	21	18	11
CTE2	*E-5/℃	44	60	62	66	61	44	27
Tg	℃	119	165	170	155	175	133	111
Flexural strength	N/mm2	137	120	118	139	115	119	126
Flexural modulus	N/mm2	19625	18000	15125	14475	13330	18847	23532
Water absorption ( Boiling, 24hrs)	%	0.2	0.3	0.36	0.37	0.29	0.2	0.16
Thermal Conductivity	W/mK	2.2	1.8	2.0	1.8	1.9	3.0	4.8