Hysol MG15F-35A | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Anhydride cured
  • Tg: 190°C
  • For high voltage & high power discretes

Product Description

Hysol MG 15F-35A epoxy molding compound delivers outstanding performance and ease of use. It is an anhydride cured molding compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature.

Hysol MG 15F-35A is a heat curable epoxy with good electrical and high temperature stability, typicall used for power discrete and high voltage rectifiers. It meets UL 94 V-0 Flammability at 3mm thickness.

Product Family
MG15F-35A  
Pellet Powder
14 mm N/A mm
4.5 gr N/A gr
10 kg 1 kg

Catalog Product

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Technical Specifications

General Properties
Color
Color
The color
Black
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.82
Shelf Life
Shelf Life @ 5°C 365 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
20 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
20 ppm
Physical Properties
Spiral Flow @ 175°C 64 cm
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
190 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.7 W/m.K
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V0
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
21 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
70 ppm/°C
Gel Time
Gel Time @ 175°C / 347°F 20 s
Electrical Properties
Water Extract Data
Conductivity 20 mmhos/cm
Dissipation Factor
Dissipation Factor @ 23°C /1 kHz 0.004
Dissipation Factor @ 23°C /100 kHz 0.008
Dielectric Constant
Dielectric Constant @ 1000 kHz 3.62
Mechanical Properties
Molded Shrinkage 0.5 %
Water Extract Data
pH of extract 4.5
Flexural Modulus
Flexural Modulus @ 25°C 15200 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
120 N/mm2
Curing Conditions
Transfer Pressure 40 - 80 kg/cm2
Transfer Time 6 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 8 - 12 hrs
Curing Schedule
Curing Time @ 175°C / 347°F (Automold) 60 - 75 s
Curing Time @ 190°C / 374°F (Automold) 45 - 60
Mold Temperature 175 - 200 °C
Preheat Temperature 77 - 94 °C