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Hysol GR15F-MOD2C | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Very High Glass Transition Temperature: 236°C
  • Longer spiral flow than MOD2
  • Designed for high voltage, high power discrete packages

Product Description

Hysol GR15F-MOD2C is a black, epoxy-based molding compound designed for high voltage, high temperature semiconductor applications. It has a very high Glass Transition Temperature (Tg) of 236°C and is in use in 2nd generation silicon carbide (SiC) MOSFET of world’s leading manufacturer of Silicon Carbide based diodes for power control and management. This C product is a longer spiral flow version of the MOD2.

Hysol GR15F-MOD2C is the world's first high Tg, "Green" Anhydride. Anhydride-based epoxy has traditionally had a low Tg and contained halogens, making it not environmentally "Green". On the other hand, anhydride chemistries have very good HTRB test results because there is very little ion movement at higher temperatures, the traditional cause of HTRB failures. Hysol's new MG15F-MOD2C is a breakthrough product that offers an incredibly high Tg, and is an environmentally "green" product without any halogens (Bromine, Chlorine) or antimony (Sb).

Hysol GR15F-MOD2C is well suited for SiC devices. Older generation silicon Si MOSFETS operated at (only) 600V. New Silicon Carbide devices operate at 1200V. These new 1200V MOSFETS deliver power density and switching efficiency at half the cost per amp of our previous generation MOSFETs. CREE claims that with this new MOSFET platform, that they already have design wins in multiple segments like solar inverters and uninterruptible power supply (UPS) systems. They continue to say that due to rapid acceptance of this 2nd generation of SiC MOSFETs, CREE is shipping pre-production volumes ahead of schedule and ramping volume production in-line with customer demand.

Hysol GR15F-MOD2C has excellent high temperature reliability bias (HTRB) test results. MG15F-MOD2C Outperforms competition on HSOP “plastic RF module” by passing 1500 cycles -65/+200ºC. Furthermore, it is qualified on TO220 & TO247 packages with large silicon carbide die running up to 1200V at an operation temperature.To add to that, Hysol has more than 12 years experience molding HF RF amplifiers guaranteed for 200°C for continuous operation. 

Product Family
N/A mm
N/A gr
1 kg

Catalog Product

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Technical Specifications

General Properties
The color
Filler Content 81.5 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 183 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
5 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
5 ppm
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 16,636 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
120 N/mm2
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds 85
Storage (DMA) Modulus
Storage (DMA) Modulus @ 175°C 14,662 N/mm2
Storage (DMA) Modulus @ 25°C 19,909 N/mm2
Storage (DMA) Modulus @ 260°C 5,440 N/mm2
Electrical Properties
Dielectric Constant
Dielectric Constant
Dielectric Constant (k), commonly known as relative permittivity, is a number relating the ability of a material to carry alternating current to the ability of vacuum to carry alternating current.

It determines the ability of an insulator to store electrical energy and is the ratio of electric permeability in vacuum against the electric permeability of a material.

The lower the dielectric constant (κ) and dissipation factor, the less energy is absorbed from an electric field, making it a much better insulator.

It is a dimensionless property that can be affected by various factors such as the
thickness uniformity of a material, insufficient contact between the sample and electrodes, water adsorption and contact resistance.
Dielectric Constant @ 1000 kHz 3.62
Dissipation Factor
Dissipation Factor
Dissipation factor is commonly known as loss tangent or tan delta.

It is a ratio of the loss index and the relative permittivity and it measures the inefficiency of an insulating material to maintain energy (that otherwise dissipates in the form of heat). The lower the factor, the better the insulation.

It is the reciprocal of the quality factor and always refers to a specific temperature and frequency.
Dissipation Factor @ 25°C /1000 kHz 3.44
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.8x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
15 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
42 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 31 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
236 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.78 W/m.K
Spiral Flow
Spiral Flow @ 175°C 109 cm
UL94 Rating
UL94 @ 1/4 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F (Automold) 50 - 80 s
Curing Time @ 175°C / 347°F (Conventional Mold) 150 - 200 s
Curing Time @ 190°C / 374°F (Automold) 30 - 60
Mold Temperature 175 - 190 °C
Preheat Temperature 80 - 90 °C
Transfer Pressure 40 - 80 kg/cm2
Transfer Time 10 - 20 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 2 - 6 hrs

Additional Information

Epoxy molding compounds for Silicon Carbide (SiC) Shottky diodes. 

Hysol GR15F-MOD2C Black is sometimes spelled in slightly different ways including:

  • Hysol MG 15F-MOD2 C
  • Hysol MG15F-MOD2 C
  • Hysol MG 15F-MOD2C
  • Hysol GR15F-MOD2C
  • Hysol GR 15F-MOD2C