Hysol GR15F-MOD2C | Black Epoxy Mold Compound
- Very High Glass Transition Temperature: 236°C
- Longer spiral flow than MOD2
- Designed for high voltage, high power discrete packages
Hysol GR15F-MOD2C is a black, epoxy-based molding compound designed for high voltage, high temperature semiconductor applications. It has a very high Glass Transition Temperature (Tg) of 236°C and is in use in 2nd generation silicon carbide (SiC) MOSFET of world’s leading manufacturer of Silicon Carbide based diodes for power control and management. This C product is a longer spiral flow version of the MOD2.
Hysol GR15F-MOD2C is the world's first high Tg, "Green" Anhydride. Anhydride-based epoxy has traditionally had a low Tg and contained halogens, making it not environmentally "Green". On the other hand, anhydride chemistries have very good HTRB test results because there is very little ion movement at higher temperatures, the traditional cause of HTRB failures. Hysol's new MG15F-MOD2C is a breakthrough product that offers an incredibly high Tg, and is an environmentally "green" product without any halogens (Bromine, Chlorine) or antimony (Sb).
Hysol GR15F-MOD2C is well suited for SiC devices. Older generation silicon Si MOSFETS operated at (only) 600V. New Silicon Carbide devices operate at 1200V. These new 1200V MOSFETS deliver power density and switching efficiency at half the cost per amp of our previous generation MOSFETs. CREE claims that with this new MOSFET platform, that they already have design wins in multiple segments like solar inverters and uninterruptible power supply (UPS) systems. They continue to say that due to rapid acceptance of this 2nd generation of SiC MOSFETs, CREE is shipping pre-production volumes ahead of schedule and ramping volume production in-line with customer demand.
Hysol GR15F-MOD2C has excellent high temperature reliability bias (HTRB) test results. MG15F-MOD2C Outperforms competition on HSOP “plastic RF module” by passing 1500 cycles -65/+200ºC. Furthermore, it is qualified on TO220 & TO247 packages with large silicon carbide die running up to 1200V at an operation temperature.To add to that, Hysol has more than 12 years experience molding HF RF amplifiers guaranteed for 200°C for continuous operation.
| Color |
|Filler Content||81.5 %|
| Specific Gravity |
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
|Spiral Flow @ 175°C||109 cm|
| Volume Resistivity |
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
| Thermal Conductivity |
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
| UL 94 Rating |
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.
HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
|Transfer Pressure||40 - 80 kg/cm2|
|Transfer Time||10 - 20 s|
Epoxy molding compounds for Silicon Carbide (SiC) Shottky diodes.
Where do we go from here?
Do you have any molding compounds that can be used for Space applications and withstand temperatures above 200°C?
There is not much research going on regarding EMC specifically suitable for space applications.
Due to the restriction of the EMC chemistry system itself, they all start to show some extent of properties degradation from 200 ℃. Hysol has done research on innovative resin/hardener types and modifications, but the results are still confidential and could not be shared yet. For example, there is research in china and japan regarding the benzoxazine resin types in the academic institute, but again, not been commercialized yet. Here is a review paper for your reference. There are some other types of encapsulants such as silicone-based ones that could resist higher temperatures, but they are not suitable for the molding process but for potting.
How do you measure temperature stability in EMCs? Is there an industry standard?
The ideal is to test the stability of each property for long hours on your operating temperatures. As you can see, there are several groups of properties to describe an EMC product. The degradation of hygro-thermomechanical, electrical, and chemical properties is what we look into while doing the high-temperature storage tests.