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Hysol GR600-P1 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Designed for DPAK (TO252) & D2PAK
  • MSL1 Capable on Ni-plating
  • Excellent thermal cycle performance

Product Description

Hysol GR600 is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of power discrete semiconductor packages. It is designed with DPAK, D2PAK, TO220 and TO252 in mind. Once molded and post-mold cured, this product provides optimum protection and reliability for these capacitor devices. It is laser markable with low ionic properties that help achieve an excellent thermal cycling performance.

Hysol GR600 is an environmentally "green" product, meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. Previously, MG-series mold compounds dominated the space for power discrete semiconductor componentst but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on DPAK and D2PAK packages. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR600 meets UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness.

Product Family
GR600  
Pellet
16 mm
7.7 gr
10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications

General Properties
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.00
Color
Color
The color
Black
Filler Content 88 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -4°C 183 days
Chemical Properties
Extractable Ionic Content, after 20 hours
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
5.9 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
4.9 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 168h @ 85ºC | 85% RH 0.20 %
Mechanical Properties
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
153 N/mm2
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds 82
Flexural Modulus
Flexural Modulus @ 25°C 22500 N/mm2
Storage (DMA) Modulus
Storage (DMA) Modulus @ 25°C 27353 N/mm2
Storage (DMA) Modulus @ 175°C 954 N/mm2
Storage (DMA) Modulus @ 260°C 809 N/mm2
Molded Shrinkage TBD %
Water Extract Data, 20hrs water boil
Water Extract Data, 20hrs water boil
Water Extract Data, 20hrs water boil
Conductivity 40 mmhos/cm
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
5.6x1016 Ohms⋅cm
Thermal Properties
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 27 s
Spiral Flow
Spiral Flow @ 175°C 34 cm
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
119 °C
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
7.1 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
31 ppm/°C
UL94 Rating
UL94 @ 1/4 inch V0
Curing Conditions
Preheat Temperature 70 - 90 °C
Mold Temperature 175 - 190 °C
Transfer Pressure 40 - 150 kg/cm2
Transfer Time 5 - 15 s
Curing Time
Curing Time @ 175°C / 347°F 120 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs

Additional Information

Designed for DPAK (TO252) & D2PAK (TO262) Power Discrete Packages

DPAK and D2PAK are power discrete semiconductor packages that are not easy to mold. The package geometry is not very difficult, but once molded, these devices need to be tested under BIAS before and after both humidity exposure and thermal cycling. This test is called the High Temperature Reverse Bias (HTRB) testing and is where most semiconductor epoxy mold compounds fail. Once biased, the device experience "gate leakage" and then fail catastrophically.

Furthermore, most DPAK and D2PAK packages are often built using a Nickel (Ni) plating. Nickel is notoriously difficult to adhere to and as such make it difficult to pass high MSL performance levels.

Finally, DPAK and D2PAK packages are still mature products and as such, the products used to mold them must be cost-competitive. The GR600 EMC is the first product in a series designed to meet all these criteria.