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Hysol GR30 was formulated to have better electrical properties then its predecessor. This means that the GR30 passes higher levels of high temperature reverse bias (HTRB) than the standard GR300 and offers excellent HTRB performance. Additionally, it is an environmentally "Green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. Previous MG-series EMC dominated the space for power semiconductors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products. It is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Nickel or Nickel-plated leadframes. And to top that up, it meets UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness.
Designed for TO220 & TO247 devices
TO220 and TO247 are big, bulky packages, so molding these products with a standard mold compound is fairly easy without using any fine fillers. The trouble with these packages however is that epoxy mold compounds used typically fail Hig Temperature Reverse Bias (HTRB) testing, which exposes the device to humidity and temperature while the device is under BIAS. Devices often experience "gate leakage" under these conditions and fail catastrophically.
Furthermore, these devices are often used using a Nickel (Ni) leadframe, which is very difficult to adhere to. Therefore, epoxy molding compound must have a very good adhesion to Nickel to achieve MSL1 preconditioning.