Hysol GR30 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Designed for TO220 & TO247
  • Improved version of GR300
  • Faster cycle time for Automold

Product Description

Hysol GR30 is a halogen free, black, semiconductor-grade epoxy molding compound or duroplast designed for the encapsulation and protection of TO220 and TO247 power devices. Once molded and post-mold cured, this product provides optimium protection and reliability for these semiconductor devices. It is a more productive version of GR300 with a CTI of 600V. While GR300 is a great product for TO220 and TO247 it is not as productive as other EMC products. The number of shots that can be done is less than some other EMC and depending on the age of the mold, the GR300 can sometimes stick in the mold making it more difficult to get the parts out. Furthermore, GR300 was designed to be used in multi gang pot (MGP) molds and conventional molds where the cure time does not need to be fast. GR30 has a shorter gel time, giving it a faster cycle time for automold equipment.

Hysol GR30 was formulated to have better electrical properties then its predecessor. This means that the GR30 passes higher levels of high temperature reverse bias (HTRB) than the standard GR300 and offers excellent HTRB performance. Additionally, it is an environmentally "Green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. Previous MG-series EMC dominated the space for power semiconductors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products. It is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Nickel or Nickel-plated leadframes. And to top that up, it meets UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness. This product is an alternative that can easily replace the discontinued Kyocera KE-G300S.

Product Family
35 mm 14 mm
6.2 gr 40 gr
15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
The color
Filler Content 81 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 183 days
Physical Properties
Spiral Flow @ 175°C 62 cm
Chemical Properties
Moisture absorption 0.31 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 16487 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
120 N/mm2
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C 84
Storage (DMA) Modulus
Storage (DMA) Modulus @ 175°C 5953 N/mm2
Storage (DMA) Modulus @ 25°C 21145 N/mm2
Storage (DMA) Modulus @ 260°C 1098 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
13 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
57 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 17 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
183 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.95 W/m.K
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F 80 - 150 s
Mold Temperature 175 - 190 °C
Preheat Temperature 70 - 90 °C
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs
Transfer Pressure 40 - 100 kg/cm2
Transfer Time 5 - 30 s

Additional Information

Designed for TO220 & TO247 devices

TO220 and TO247 are big, bulky packages, so molding these products with a standard mold compound is fairly easy without using any fine fillers. The trouble with these packages however is that epoxy mold compounds used typically fail Hig Temperature Reverse Bias (HTRB) testing, which exposes the device to humidity and temperature while the device is under BIAS. Devices often experience "gate leakage" under these conditions and fail catastrophically.

Furthermore, these devices are often used using a Nickel (Ni) leadframe, which is very difficult to adhere to. Therefore, epoxy molding compound must have a very good adhesion to Nickel to achieve MSL1 preconditioning.


GR30 can ALSO be used for Electric Vehicle Rotors

Epoxy molding compound is used to bond the magnet and rotor core by using a transfer molding method. There are several slots that go through the core. The permanent magnets are inserted in the slot and then the mold compound is filled into the gap to bind the magnet and the rotor core together.

The critical function of the material is to have a strong binding force between the magnet and the rotor core while also having a good filling capability. It should also have excellent reliability at working temperature. GR30 is a green material without Br/Sb, in compliance with ROHS that can cure fast for high Units per Hour. 

Molding compounds have already been used in Rotors with Iron as a base material and with rotor working speeds up to 20000rpm and working temperatures up to ±150°C. They pass both Temperature cycling and High temperature ATF resistance tests while retaining 100% of their flexural strength and flexural modulus. This highlights the product's excellent property stability post post-automotive fluid resistance testing.