Product Description
Hysol GR30 is a halogen free, black, semiconductor-grade epoxy molding compound or duroplast designed for the encapsulation and protection of
TO220 and TO247 power devices. Once molded and post-mold cured, this product provides optimium protection and reliability for these semiconductor devices. It is a
more productive version of GR300. While GR300 is a great product for TO220 and TO247 it is not as productive as other EMC products. The number of shots that can be done is less than some other EMC and depending on the age of the mold, the GR300 can sometimes stick in the mold making it more difficult to get the parts out. Furthermore, GR300 was designed to be used in multi gang pot (MGP) molds and conventional molds where the cure time does not need to be fast. GR30 has a shorter gel time, giving it a
faster cycle time for automold equipment.
Hysol GR30 was formulated to have better electrical properties then its predecessor. This means that the GR30 passes higher levels of high temperature reverse bias (HTRB) than the standard GR300 and offers excellent HTRB performance. Additionally, it is an environmentally "Green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. Previous MG-series EMC dominated the space for power semiconductors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products. It is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Nickel or Nickel-plated leadframes. And to top that up, it meets UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness.