Product Description
Hysol GR30HT is a high thermal conductivity version of GR30. It is a black semiconductor-grade epoxy molding compound (duroplast) designed for the encapsulation and protection of TO92, TO3P, TO220 and TO247 power devices. Once molded and post-mold cured, this product provides optimum protection and reliability for these semiconductor devices. Compared to the standard GR30 version, which has a thermal conductivity of 0.95 W/mK, GR30HT boasts more than twice as much thermal conductivity with 1.95 W/mK while also maintaining the high performance and moldability enhancements over the GR300 roots.
Hysol GR30HT is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. Previous MG-series EMC dominated the space for power semiconductors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Nickel or Nickel-plated leadframes. It also achieves UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness.