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Hysol GR30HT | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Hysol GR30HT | Black Epoxy Mold Compound
Hysol GR30HT | Black Epoxy Mold Compound
GR30HT High Thermally Conductive Epoxy Molding Compound Duroplast
Hysol GR30HT | Black Epoxy Mold Compound
GR30HT High Thermally Conductive Epoxy Molding Compound Duroplast
Main features
  • High Thermal Conductivity GR30
  • Designed for TO92 and TO220 packages
  • Excellent reliability under high temperature and bias

Product Description

Hysol GR30HT is a high thermal conductivity version of GR30. It is a black semiconductor-grade epoxy molding compound (duroplast) designed for the encapsulation and protection of TO92, TO3P, TO220 and TO247 power devices. Once molded and post-mold cured, this product provides optimum protection and reliability for these semiconductor devices. Compared to the standard GR30 version, which has a thermal conductivity of 0.95 W/mK, GR30HT boasts more than twice as much thermal conductivity with 1.95 W/mK while also maintaining the high performance and moldability enhancements over the GR300 roots.

Hysol GR30HT is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. Previous MG-series EMC dominated the space for power semiconductors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Nickel or Nickel-plated leadframes. It also achieves UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness.

Product Family
GR30HT  
Pellet
14 mm
5.8 gr
1 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Black
Filler Content 72 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 2.1
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 183 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 20 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 20 ppm
Mechanical Properties
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds 81
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 21 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 56 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 21 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 186 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 1.9 W/m.K
Spiral Flow
Spiral Flow @ 175°C 88 cm
UL94 Rating
UL94 @ 1/4 inch V0
UL94 @ 1/8 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F 80 -150 s
Mold Temperature 175 - 190 °C °C
Preheat Temperature 70 - 90 °C °C
Transfer Pressure 40 - 100 kg/cm2
Transfer Time 5 - 30 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs

Additional Information

Designed for TO220 & TO247 devices

TO220 and TO247 are big, bulky packages, so molding these products with a standard mold compound is fairly easy without using any fine fillers. The trouble with these packages however is that epoxy mold compounds used typically fail High Temperature Reverse Bias (HTRB) testing, which exposes the device to humidity and temperature while the device is under BIAS. Devices often experience "gate leakage" under these conditions and fail catastrophically.

Furthermore, these devices are often used using a Nickel (Ni) leadframe, which is very difficult to adhere to. Therefore, epoxy moldng compound must have a very good adhesion to Nickel to achieve MSL1 preconditioning.