DOWSIL™ TC-5860 Thermally Conductive Compound

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

Main features

High dielectric strength
6.0 W/m-K Thermal Conductivity
Suitable for High Power Electronics

Product Description

DOWSIL™ TC-5860 Thermally Conductive Compound is a high-performance, one-part, non-curing silicone thermal interface material engineered for efficient heat dissipation in high-power electronic systems. Featuring 6.0 W/m·K thermal conductivity, high dielectric strength, and the ability to achieve thin bondline thicknesses of approximately 40 μm, TC-5860 effectively transfers heat from semiconductors, power modules, processors, and PCB assemblies to heat sinks or chassis structures. Its solvent-free formulation maintains viscosity stability after opening, enabling consistent dispensing and stencil printing performance throughout production. Designed for applications where thermal efficiency, electrical insulation, and long-term reliability are critical, TC-5860 provides a durable thermal bridge that helps improve device performance, extend service life, and support the thermal management requirements of next-generation power electronics.

Key Features

6.0 W/m·K thermal conductivity for efficient heat transfer.
One-part, non-curing formulation eliminates curing requirements.
Thin bondline capability of approximately 40 μm at 40 psi.
Low thermal resistance of 0.111 °C·cm²/W.
Solvent-free formulation for long-term viscosity stability.
High dielectric strength of 8.0 kV/mm for electrical insulation.
High volume resistivity of 8 × 10¹¹ Ω·cm.
Automated dispensing compatible for high-volume manufacturing.
Stencil printable for controlled thermal interface application.
Maintains a positive heat sink seal to improve thermal transfer efficiency.
Excellent thermal stability across an operating range of -40°C to 150°C.
Suitable for power electronics, IGBT modules, SiC power modules, DC-DC converters, onboard chargers, industrial drives, telecom equipment, networking hardware, AI servers, high-performance computing systems, and PCB-to-heat-sink interfaces.

Product Family
DS-TC5860

1. Select Package Type

1kg Jar

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Shipping in 5 weeks

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Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties
Color Color The color	Gray
Component System Component System Describes the number of components that must be supplied, mixed, or activated before application or cure.	One Part
Density Density Volumetric mass per unit	3500 kg/m3
Evaporation Rate	24h @150°C: 0.045%
Physical Properties
Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application	350000 mPa.s
Thermal Properties
Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.	6.0 W/m.K
Thermal Impedance	0.111 °C·cm²/W
Electrical Properties
Dielectric Strength Dielectric Strength Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.	8.0 kV/mm
Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.	8.0x10^11 Ohms⋅cm

Additional Information

DOWSIL™ TC-5860: High Thermal Conductivity Compound for High-Power Electronics

DOWSIL™ TC-5860 Thermally Conductive Compound is a one-part, gray, non-curing silicone thermal compound designed for high-power electronics requiring efficient heat transfer and electrical insulation. With 6.0 W/m·K thermal conductivity, 40 µm bondline thickness at 40 psi, high dielectric strength, and a solvent-free formulation, TC-5860 helps create a reliable thermal bridge between electrical devices, PCB assemblies, heat sinks, and chassis.

6.0 W/m·K thermal performance with no cure required — TC-5860 supports thin bondlines, stable viscosity, automated dispensing, and stencil printing for compact high-power electronics.

The grease-like silicone matrix is highly loaded with thermally conductive fillers to help improve heat transfer, maintain a positive heat sink seal, and support reliable device operation over time.

Designed for high-power electronics cooling — suitable for power modules, PCB assemblies, processors, semiconductor packages, heat sinks, chassis interfaces, and compact electronic systems.

TC-5860 is suitable for automated dispensing and stencil printing, making it a strong fit for manufacturing lines that require consistent application without a cure step.

DOWSIL TC-5860 thermally conductive compound for high power electronics

6.0 W/m·K Thermal Conductivity • One-Part • Non-Curing • High Dielectric Strength

Features & Benefits

6.0 W/m·K thermal conductivity — supports efficient heat dissipation.
One-part material — no mixing required.
Non-curing compound — eliminates cure ovens and cure scheduling.
Solvent-free formulation — helps maintain viscosity stability after opening.
Thin BLT capability — achieves approximately 40 µm at 40 psi.
High dielectric strength — suitable for electrically insulating thermal interfaces.
Automated dispensing compatible — supports high-volume production.
Stencil printable — suitable for controlled patterned TIM application.

Typical Applications

High-power electronics thermal management.
Power module to heat sink interfaces.
PCB assembly to chassis thermal coupling.
Processor and semiconductor package cooling.
Automated dispensing applications.
Stencil printed thermal interface patterns.
Compact electronics requiring thin bondlines.

High-Power Electronics Perspective

Thermal Challenges in Compact High-Power Devices

High-power electronic devices continue to move toward smaller and more compact designs while generating higher heat loads. DOWSIL™ TC-5860 helps address this challenge by acting as a thermal bridge between the heat source and the heat sink or chassis, supporting efficient heat removal, improved device efficiency, and long-term reliability.

High Heat Transfer

6.0 W/m·K thermal conductivity helps move heat away from power devices and PCB assemblies.

Thin BLT Performance

Thin bondline capability helps reduce thermal resistance across the device-to-heat-sink interface.

No-Cure Processing

The non-curing, one-part format simplifies application and eliminates oven curing from the assembly flow.

Typical Properties

Engineering Data for DOWSIL™ TC-5860

Property	DOWSIL™ TC-5860	Condition / Note
Type	One-part compound	Non-curing thermal compound
Color	Gray	Typical appearance
Viscosity	350,000 cP	CP52#, 1 RPM
Density	3.5 g/cm³	Typical value
Thermal Conductivity	6.0 W/m·K	ISO 22007-2
Thermal Resistance	0.111 °C·cm²/W	At 40 psi
Bondline Thickness	40 µm	At 40 psi
Evaporation	0.045%	24 hours at 150 °C
Dielectric Strength	8.0 kV/mm	Electrical insulation
Volume Resistivity	8.0 × 10¹¹ Ω·cm	Typical value
Useful Temperature Range	-40 to 150 °C	Typical operating range
Shelf Life	12 months	Stored below 30 °C

*Typical properties are not intended for specification writing. Verify performance under actual application, assembly pressure, bondline thickness, printing process, and reliability conditions.

Applications

Where DOWSIL™ TC-5860 Fits

High-Power Electronics

Designed for high-power devices where heat must be transferred efficiently to a heat sink or chassis.

Power modules
Electronic modules
High-density PCB assemblies

Heat Sink Interfaces

Maintains a positive heat sink seal to improve heat transfer from electrical devices or PCB assemblies.

Device-to-heat sink
PCB-to-chassis
Thermal bridge interfaces

Automated Application

Compatible with automated dispensing and stencil printing for repeatable thermal interface placement.

Automated dispensing
Stencil printing
Production line integration

Processing

Dispensing, Printing & Application

Automated Dispensing

TC-5860 is suitable for automated dispensing where repeatable thermal compound placement is required.

Stencil Printing

Stencil printing enables controlled TIM patterns and consistent bondline coverage in high-power electronics.

Storage & Re-Mixing

Store below 30 °C. Slight settling may occur in highly filled thermal materials, so re-mixing by stirring is recommended before use.

Technology Advantage

How TC-5860 Supports High-Power Electronics Design

Design Challenge	DOWSIL™ TC-5860 Benefit
High-power electronics generate concentrated heat.	6.0 W/m·K thermal conductivity helps conduct heat away from sensitive devices.
Thin interfaces are needed to reduce thermal resistance.	40 µm BLT at 40 psi supports thin thermal interface design.
Cure steps add process time and complexity.	One-part, non-curing material eliminates cure requirements.
Production needs stable and repeatable material application.	Solvent-free formulation supports stable viscosity after opening and consistent application.

Next Steps

Ready to Evaluate DOWSIL™ TC-5860?

Share your device type, heat sink or chassis design, target bondline thickness, application method, assembly pressure, and thermal resistance requirements. We can help assess whether DOWSIL™ TC-5860 is suitable for your high-power electronics thermal management application.

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