LOCTITE ABLESTIK ABP 6892
- Designed for Fingerprint Sensors
- Low stress for ultra thin glass
- Low outgassing and finest filler
LOCTITE ABLESTIK ABP 6892 transparent non-conductive die attach BMI/Acrylate is designed to be used for fingerprint sensors. With its low stress and robust mechanical properties the ABP 6892 is targeted for applications that require the bonding of fingerprint sensors in credit cards (such as VISA, Mastercard and American Express), bank cards or other cards that require a secondary authentication process. Due to its low filler size (only a tiny % with max size less than 10um) and low viscosity it is ideal for wire bonding protection. Sensors and devices using the ABP 6892 die bonding material will have a greater resistance to delamination and overall improvement in package reliability.
LOCTITE ABLESTIK ABP 6892 transparent low stress, low modulus adhesive is ideal for ultra-thin glass or ceramic bonding or sensor dies up to 10x10mm. It has an improved flow for thin bond line (<15um) and excellent workability with a long opening (2 hours) and staging (8 hours) time. This thin bondline enables the better capturing of fingerprints and makes it ideal for optical sensors. This is only made better by the reflow resistant resistant refractive index of 1.50, minimal resin bleed out and low transmittance.
LOCTITE ABLESTIK ABP 6892 has also been used to protect the balls of Au wirebonds around the edge of a chip. ABP6892, when applied by jetting worked well and the low and fast cure time made it suitable for the production process also.
LOCTITE ABLESTIK ABP 6892 can cure below 80°C and provides a robust adhesion and void free bond line post 60°C/90% RH (96hrs) and HTS 120°C (100hrs).
- 15 minutes ramp to 80ºC, hold 60 minutes or
- 15 minutes ramp to 130ºC, hold 30 minutes
|Density (g)||1.05 g/cm3|
| Refractive index |
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.
The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
| Work life @25°C |
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
| Thixotropic index |
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.
A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.
It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
| Viscosity |
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.