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LOCTITE ABLESTIK ABP 8068TB

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • Good workability
  • High thermal stability
  • Solder replacement

Product Description

LOCTITE ABLESTIK ABP 8068TB is a silver-filled semi-sintering die attach adhesive designed for semiconductor packages with high thermal and electrical requirements. It is formulated with a more enhanced resin bleed control than its predecessor LOCTITE ABLESTIK ABP 8068TA and it is designed to replace Pb Solder in Power and Low noise amplifier (RF SiP) type consumer applications.

LOCTITE ABLESTIK ABP 8068TB is designed to provide high adhesion and low stress which are essential for the thermal and reliability performances of high end power packages. The thermal performance of this material is comparable to that of a solder paste product (>100 W/mK thermal conductivity). It passes MSL 2A and MSL3 tests

LOCTITE ABLESTIK ABP 8068TB is not compatible with bare copper but it works fine and provides good sintering with Ag or Au electroplated Cu, Ag and PPF leadframes. It is an ideal solution for dies that are smaller than 2x2 mm and it can be fast and easily processed with standard die attach equipment

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Product Family
ABP8068TB  
5cc Syringe
2.5 cc

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Not Available Shipping in 8 weeks

Technical Specifications

General Properties
Shelf Life
Shelf Life @ -40°C 365 days
Work life @25°C 16 hours
Chemical Properties
Extractable Ionic Content, after 20 hours
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
20 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
1.5 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
0.5 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 168h @ 85ºC | 85% RH 0.21 %
Mechanical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Viscosity 11,500 MPa.s
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
5.5
Die Shear Strength
Die Shear Strength
Die Shear Strength is the force that has to be applied to the side of the semiconductor die before it shears from its mounting.

Shear strength is measured for various die sizes, substrates and operating temperatures so check the Technical data sheet for your intended usage.
2x2mm @260°C 6.5 kgf 
3x3mm @260°C 10.8 kg-f
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of a solid material. It is the slope of stress strain curve of a specific material under direct tensile loading.

Tensile modulus can be used to predict the elongation or compression of an object as long as the stress is less than the tensile strength of the material.
Tensile Modulus @25°C 12,500 N/mm2
Tensile Modulus @150°C 1,100 N/mm2
Tensile Modulus @250°C 650 N/mm2
Tensile Modulus @-65°C 15,600 N/mm2
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
25 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
100 W/m.K
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
25 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
103 ppm/°C

Additional Information

Pricing & Availability

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