Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE® ABLESTIK ATB 120U Non conductive adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability of Henkel materials. It is the most transparent film available for high volume applications and is widely used for glass attach in smart phones (bonding the finger print sensor “under glass”).This 2 in 1 format is designed for base die and die to die (>1x1mm) applications, moving to thing wafer (<100um).
LOCTITE® ABLESTIK ATB 120U Non conductive adhesive film has a thickness of 20um but is also available in 10, 30 and 40um. It can be used to absorb CTE mismatch between substrates but the extend to which it can be effective will depend on the bond area. The bigger the parts, the bigger the mismatch and stress. Even flexible adhesives won’t behave that flexible when thin bond lines need to absorb stress in larger bond areas. For example the glass wind shield in cars is bonded with flexible PUR adhesive with ±2-3mm bond line thickness to absorb movements. So from a Die attach film perspective, a 20um bond line will give half the stress compared to 10um!
ATB 120U Transmittance vs Other films light transmittance