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Sensors

CMOS Image Sensors

CMOS Image Sensors

Requirements:

  • Fast (UV) and or low temperature cure
  • High adhesion on engineering plastics (like LCP) & metals
  • Low outgassing

Sensor Die Attach to Substrate

Key Requirements

▪ High adhesion on wide variety of substrates

▪ Fast cure at temperatures from 80ºC to 175ºC

▪ Low moisture absorption

▪ Excellent impact resistance

▪ Operating temperature range -40ºC to 130ºC

▪ Low halogen

Recommended LOCTITE Products

▪ ABLESTIK QMI 536NB Low stress, low resin bleed, low moisture absorption

▪ ABLESTIK ABP 2035SC(R) High adhesion, low temperature cure, small to medium die size

▪ ABLESTIK ABP 6892 Low stress for ultra-thin die, transparent, low temperature cure

▪ ABLESTIK ABP 2040LV Low stress and low warpage, fast and low temperature cure

 

Lens Holder, Lens Barrel and IR Filter Bonding

Key Requirements

▪ Adhesion to variety of substrates (PC, LCP, etc.)

▪ Low temperature cure <100°C

▪ Fast cure < 60mins

▪ Operating temperature range -40ºC to 130ºC

▪ Low halogen content

Recommended LOCTITE Products

▪ ABLESTIK 8387B High adhesion, medium viscosity, low temperature cure

▪ ABLESTIK ABP 2035SC(R) High adhesion, low temperature cure

▪ ABLESTIK ABP 6892 Low stress for thin bond line, transparent, low temperature cure

▪ LOCTITE 3220(WH) High adhesion, low viscosity, low temperature cure

(3220 has black color, also white 3220WH available)

 

UV CURE for active alignment

Recommended LOCTITE Products (with Light and or Thermal Cure for Active Alignment) :

▪ ECCOBOND OGR-150THTG Low viscosity, UV and low temperature cure

▪ ABLESTIK NCA 2280LV Low viscosity, fine needle dispensing, UV and low temperature cure

▪ LOCTITE 3217 High viscosity, stencil printable, UV and low temperature cure

▪ LOCTITE 3707 Medium viscosity, “edge bonding” by UV and thermal cure

▪ LOCTITE 3103 Medium viscosity, UV cure only

▪ LOCTITE 3703 High and thixotropic viscosity to prevent migration, UV cure only

▪ LOCTITE LS3106P Low viscosity for water proof “self-sealing”, UV and LED cure

 

Image Sensor CSP Underfill

Key Requirements

▪ Good bump protection on variety of substrates

▪ High Tg, low CTE for minimal stress

▪ Excellent impact resistance

▪ Temperature cycling -55ºC to 150ºC

▪ Low halogen

Recommended LOCTITE Products

▪ ECCOBOND FP4531 High Tg (160ºC) and low CTE (28ppm), snap cure (7min 160ºC)

▪ ECCOBOND E1216M Automotive use, fast and relatively low temperature cure

▪ LOCTITE NCP 5209 Medium viscosity, high Tg (by thermal compression bonding)