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Sensors

Fingerprint Sensors

Fingerprint Sensors

 

Application information

Recent market information from IHS and Yole anticipating gradual transition to 3D image sensing …

Capacitive FPS technology not suitable for Under Glass (UG) or Under Display (UD)

Optical and Ultrasonic FPS being pursued for improved security and better fit for full screen smart phone

Mobile FPS market impacted by 3D Face ID success

Integrating FPS in Smart Cards

 

Requirements:

  • Fast (UV) and or low temperature cure
  • Thin bond line control
  • Low stress, low warpage
  • Good and stable electrical properties

“Capacitive Sensing” = A low RF signal is injected into the finger, then read by the pixels on the silicon acting like antenna

Successful use of Henkel’s Adhesive Films for Glass Sensor Attach in HVM

 

Glass Attach to Sensor Die

Key Requirements

  • ▪ High adhesion
  • ▪ Low temperature cure
  • ▪ Low moisture absorption
  • ▪ Thin bond line control

Recommended LOCTITE Products (links)

▪ ABLESTIK QMI 536NB Low warpage, low temperature cure

▪ ABLESTIK ABP 2035SC(R) High adhesion, low temperature cure

▪ ABLESTIK ABP 6892 Low stress for ultra-thin glass, low temperature cure

▪ ECCOBOND OGR-150THTG Low viscosity, UV and low temperature cure

▪ LOCTITE NCA 2280LV High viscosity, UV and low temperature cure

▪ ABLESTIK ATB 120U, 140U Low modulus FILM adhesives, oven and skip cure

 

 

 

Sensor & Controller Die Attach to FR4 or Ceramic

Key Requirements

  • ▪ High adhesion
  • ▪ Low temperature cure
  • ▪ Low warpage

Recommended LOCTITE Products

  • ▪ ABLESTIK QMI 536NB Low warpage, low temperature cure
  • ▪ ABLESTIK ABP 2035SC(R) High adhesion, low temperature cure
  • ▪ ABLESTIK ATB F125E High modulus FILM adhesive, temperature cure

 

Flip Chip Underfill for Reinforcement

Key Requirements

▪ Good flow ability

▪ Flexible product to absorb stress

▪ High adhesion

▪ High reliability

Recommended LOCTITE Products

▪ ECCOBOND UF 3811 High Tg, low CTE, rework-able, room temperature capillary flow, relatively low temperature cure (~10min @ 130°C or 1hr @ 100°C)

▪ ECCOBOND E1216M Anhydride-free, fast flow, snap curable capillary underfill

▪ LOCTITE NCP 5209 Medium viscosity, high Tg (by thermal compression bonding)

 

Electrically Conductive Adhesives (ECA) for Bezel Attach 

Key Requirements

▪ Good and stable electrical connection

with metal bezel (same like solder)

▪ Fast and low temperature cure

▪ High adhesion to metal

Recommended LOCTITE Products

▪ ECCOBOND CE3103WLV High viscosity, fast thermal cure

▪ ABLESTIK ABP 2032S High adhesion, low temperature cure

▪ ABLESTIK 2030SC(R) Low stress, low temperature cure 

 

Gap Filling Adhesives to Attach Bezel Ring to Glass

Key Requirements

▪ Good adhesion

▪ Good gap fill capability

▪ UV with second cure system

▪ Good moisture resistance

▪ Low bleed

Recommended LOCTITE Products

▪ ECCOBOND DS 3318LVT Transparent, UV and LED cure

▪ LOCTITE PC40-UMF Transparent, UV and moisture cure

 

Encapsulants for Wire Bond Protection

Key Requirements

▪ Low temperature cure

▪ Suitable modulus

▪ Passing reliability

Recommended LOCTITE Products

▪ ABLESTIK QMI 536NB Low warpage, low temperature cure

▪ ABLESTIK 8387B Fast and low temperature cure

▪ ECCOBOND FP 4654 Low stress (13ppm CTE), jet-able, excellent thermal stability

▪ ECCOBOND UF 3811 High Tg, low CTE, rework-able, room temperature capillary flow,

relatively low temperature cure (~10min @ 130°C or 1hr @ 100°C)