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Other than the classic wire bonded smart cards, we also have the CSP flip chips.
For them we can offer adhesive and underfills to bond and mechanically protect the solder ball or thermal conded connections.
ACP 3122 is an anisotropic adhesive designed for high throughput thermal compression bonding applications. It is a snap curable epoxy that conducts only in the Z axis
LOCTITE® ECCOBOND NCP 5209 is a non-conductive paste (NCP) underfill designed to facilitate next-generation fine-pitch copper pillar and copper OSP flip-chip devices.