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Hysol GR2310 | Gold Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Hysol GR2310 | Gold Epoxy Mold Compound
Hysol GR2310 | Gold Epoxy Mold Compound
GR2310 Gold Epoxy Mold Compound
Hysol GR2310 | Gold Epoxy Mold Compound
GR2310 Gold Epoxy Mold Compound
Main features
  • For MnO2 Tantalum Capacitors
  • Gold (yellow) colored
  • Halogen-free version MG33F-0520

Product Description

Hysol GR2310 is a Gold semiconductor epoxy molding compound or duroplast designed for the encapsulation and protection of Manganese Oxide (MnO2) tantalum capacitors and automotive sensor packages. Once molded and post-mold cured, this product provides optimium protection and reliability for these capacitor devices.

Hysol GR2310 is a laser markable product, designed for the new generation of capacitors. Tantalum capacitors are general purpose chip tantalum capacitors which are mature products and as such must be cost-competitive. Although the GR2310 has "only" been manufactured for 15 years or so, they are based on their halogen-containing counterparts and though these products do not contain halogens, the manufacturing process has been optimised a long time ago so as to offer the lowest cost possible.

Hysol GR2310 is an environmentally "green" product, meaning that doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. MG33F-0520, MG33F-0588 and MG33F-0602 dominated the space for tantalum capacitors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products.This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Maganese Oxide MnO2 capacitors. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR2310 meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.

Product Family
GR2310  
Powder Pellet
N/A mm 14.3 mm
N/A gr 4.4 gr

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Gold
Filler Content 72 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.82
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -4°C 365 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 13 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 9 ppm
Mechanical Properties
Water Extract Data
Water Extract Data
Water Extract Data, 20hrs water boil
Conductivity 24 mmhos/cm
pH of extract 6.0
Flexural Modulus
Flexural Modulus @ 25°C 12410 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 119.3 N/mm2
Molded Shrinkage 0.28 %
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 20 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 73 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 12 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 175 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 0.64 W/m.K
Spiral Flow
Spiral Flow @ 175°C 72 cm
UL94 Rating
UL94 @ 1/4 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F (Automold) 50 - 70 s
Curing Time @ 175°C / 347°F (Conventional Mold) 70 - 90 s
Mold Temperature 140 - 180 °C
Preheat Temperature 90 °C
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 6 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs