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Hysol GR600 SL2 is a halogen free, black, silica filled (87% filler weight) semiconductor grade epoxy molding compound designed for TO packages. This low stress, low moisture absorption product is a commercial success with many uses on TO applications.
Hysol GR600 SL2 is a green, heat curable epoxy molding compound that can be used in semiconductor packages such as TO252. Furthermore, it meets UL 94 V-0 flammability at 1/8 inch thickness.