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Hysol KL-G200S is a black, halogen-free, semiconductor grade epoxy molding compound. It provides the lowest cost of ownership for a "non-halogen containing" epoxy molding compound. It works on surface mounted diodes such as D0214 in various sizes (SMA, SMB, SMC) and other low end discrete semiconductor and sensor packages.
Hysol KL-G200S passes MSL1 260°C. It is an epoxy molding compound that contains no bromine, antimony or phosphorus flame retardant. This product is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature and provides the lowest cost of ownership with superior moldability and reliability. To top this up, it meets UL 94 V-0 Flammability at 6.35mm thickness.