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LOCTITE ABLESTIK 2025D is a Silica filled die attach adhesive with excellent dispense capabilities, designed for use in array packaging. Even though its properties are exceptional, Silica has the downside of potentially scratching the dies. That's why manufacturers tend to prefer the QMI range of products for stacking.
LOCTITE ABLESTIK 2025D has exceptional adhesion on Copper, excellent die sheer strength and MSL performance, something that makes it the product of choice for the first (mother) die. It performs excellently for this application and it compliments nicely the QMI products on die stacking applications. This product has low to medium modulus and can also be used for individual large die.