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LOCTITE ABLESTIK 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @260°C.
LOCTITE ABLESTIK 2100A is a low stress, low bleed conductive die attach with ultra low moisture absorption, suitable for laminate packages like BGA and die sizes up to 12.7 x 12.7 mm
Loctite Ablestik 2100A is a product that is an almost direct alternative to Loctite Ablestik 2000B.
Loctite Ablestik 2000B is also a conductive die attach for laminates that it is mainly used in Asian regions. For EMEA we have successfully used 2100A as a drop in for use in BGA laminate applications with great success rates.
Ablestik 2100A DSC Curve - Heat flow vs temperature
Notice how the Onset of cure (minimum cure temperature) is about 70°C. Even though we suggest curing at 175°C, as with all products you can adjust the cure schedule (with a lot of trial, error and personal work) according to your final application properties.
The volume resistivity may be reduced when curing below 175°C (compared to the TDS value), but we expect that some conductivity will be developed.