Product Description
LOCTITE ABLESTIK 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @260°C.
LOCTITE ABLESTIK 2100A is a low stress, low bleed conductive die attach with ultra low moisture absorption, suitable for laminate packages like BGA and die sizes up to 12.7 x 12.7 mm
Cure Schedule
- 30 minute ramp to 175°C + 15 minutes @ 175°C