• x

LOCTITE ABLESTIK 563K

Harmonization Code : 3920.99.28.90 |   Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
  • Good heat transfer
  • Low squeeze out
  • Thermally conductive

Product Description

LOCTITE ABLESTIK 563K epoxy adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength over a wider temperature range than is normally associated with flexible films.

LOCTITE ABLESTIK 563K  is a thermally conductive film with good heat transfer which manages to achieve a thin bondline with uniform bondline control. It comes without a carrier and is typically available in 50um and 75um microns.

 

Cure Schedule

  • 30 minutes @ 150°C
  • 2 hours @ 125°C
Product Family
563K  
10 x 12 inch 6 x 6 inch sheet
0.10 0.07

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Outgassing
CVCM
CVCM
Collected Volatile Condensable Materials
 0.04 %
TML
TML
Total Mass Loss
 0.44 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 365 days
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
 2160 hours
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 45 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 300 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 97 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 1.1 W/m.K

Additional Information

Outgassing

NASA Outgassing:

  • TML, % 0.44
  • CVCM, % 0.04
  • WVR, % 0.2