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LOCTITE ABLESTIK 8175 is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metallizations or traditional printed circuit board surfaces. It is capable of resolving fine pitch resolution (0.02 inch) when printed using either a stainless steel mesh screen or a metal mask stencil.
LOCTITE ABLESTIK 8175 meets the requirements of MIL-STD-883, Method 5011. It is a stress absorbing, electrically and thermally conductive epoxy adhesive that is typically used for die attach. This is a stencil and screen printable Pbfree alternative to solder.