LOCTITE ABLESTIK ABP 2032S
- Low temperature cure
- Good adhesion
- Electrically conductive
LOCTITE ABLESTIK ABP 2032S electrically conductive epoxy adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in small to medium die applications. It is a tried and proven product for optical sensor ASIC attach and for Lid attach for optical sensors and 3d sensing modules.
LOCTITE ABLESTIK ABP 2032S has good adhesion and good dispensing characteristics, This material can cure in temperatures as low as 80°C and works great on substrates such as Gold, Steel and Silver.
- 60 minutes @ 80°C
- 3 minutes @ 150°C or
- 10 minutes @ 120°C
| Work life @25°C |
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
| Thixotropic index |
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.
A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.
It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
| Viscosity |
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
| Thermal Conductivity |
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.