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LOCTITE ABLESTIK ABP 8037TI silver-filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates.
LOCTITE ABLESTIK ABP 8037TI silver-filled die attach adhesive paste is specifically designed to attach small diodes in high volume manufacturing. Even more specifically, it is the highest volume silver-filled die attach paste for high reliability LED manufacture when using small die on Au-finished leadframes. Used in high-volume manufacturing throughout China and Malaysia.
LOCTITE ABLESTIK ABP 8037TI is similar to Loctite Ablestik ABP 8037T, with a minor raw material change that made it adjust its naming convention.