- Home
- Products
- Die Attach Materials
- Die Attach Pastes
- LOCTITE ABLESTIK ABP 8060T
LOCTITE ABLESTIK ABP 8060T
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High heat transfer
- Soft solder replacement
- Stable at high temperatures
Product Description
LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring very high thermal and electrical conductivity.
LOCTITE® ABLESTIK ABP 8060T is a hydrophobic, electrically and thermally conductive BMI hybrid that is stable at high temperatures. This silver paste it typically used for MOSFET packages and exhibits high die shear strength.
Cure Schedule
- 45 minutes ramp from 25°C to 200°C + 60 minutes @ 200°C in N2 or air oven
- 30 minutes ramp from 25°C to 175°C + 60 minutes @ 175°C in N2 or air oven
Technical Specifications
| General Properties | |||||||||
| Filler Content | 85 % | ||||||||
| Work life @25°C Work life @25°C Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements. | 24 hours | ||||||||
| Physical Properties | |||||||||
| Thixotropic index Thixotropic index Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material. | 6 | ||||||||
| Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application | 12,000 mPa.s | ||||||||
| Chemical Properties | |||||||||
| |||||||||
| Mechanical Properties | |||||||||
| |||||||||
| Electrical Properties | |||||||||
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 2.5x10-5 Ohms⋅cm | ||||||||
| Thermal Properties | |||||||||
| |||||||||
| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 20 W/m.K | ||||||||
Additional Information
It's stated in the TDS that it needs a N2 oven. Is this a prerequisite? Can it be cured in a conventional oven and if so how will this change the cure schedule?
Many customers prefer to cure in Nitrogen, to protect components from oxidation. But curing both in Air or Nitrogen is still OK. Die shear strength is not significantly affected by the curing atmosphere.