Specialty Chemicals, Adhesives & Plastics
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LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring very high thermal and electrical conductivity.
LOCTITE® ABLESTIK ABP 8060T is a hydrophobic, electrically and thermally conductive BMI hybrid that is stable at high temperatures. This silver paste it typically used for MOSFET packages and exhibits high die shear strength.
It's stated in the TDS that it needs a N2 oven. Is this a prerequisite? Can it be cured in a conventional oven and if so how will this change the cure schedule?
Many customers prefer to cure in Nitrogen, to protect components from oxidation. But curing both in Air or Nitrogen is still OK. Die shear strength is not significantly affected by the curing atmosphere.