LOCTITE ABLESTIK ABP 8060T
- High heat transfer
- Soft solder replacement
- Stable at high temperatures
LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring very high thermal and electrical conductivity.
LOCTITE® ABLESTIK ABP 8060T is a hydrophobic, electrically and thermally conductive BMI hybrid that is stable at high temperatures. This silver paste it typically used for MOSFET packages and exhibits high die shear strength.
- 45 minutes ramp from 25°C to 200°C + 60 minutes @ 200°C in N2 or air oven
- 30 minutes ramp from 25°C to 175°C + 60 minutes @ 175°C in N2 or air oven
|Filler Content||85 %|
| Work life @25°C |
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
| Thixotropic index |
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.
A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.
It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
| Viscosity |
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
| Volume Resistivity |
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
| Thermal Conductivity |
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
It's stated in the TDS that it needs a N2 oven. Is this a prerequisite? Can it be cured in a conventional oven and if so how will this change the cure schedule?
Many customers prefer to cure in Nitrogen, to protect components from oxidation. But curing both in Air or Nitrogen is still OK. Die shear strength is not significantly affected by the curing atmosphere.