Product Description
LOCTITE® ABLESTIK ABP 8910T die attach adhesive is formulated with a medium modulus using BMI hybrid chemistry and is targeted for use on medium to large die sizes.
LOCTITE® ABLESTIK ABP 8910T is an Alumina filled, electrically insulating adhesive that is ideal for Copper, Silver, PPF and Alloy 42 substrates. It has relatively higher thermal conductivity for die attach pastes at 1.3 W/mK.
Cure Schedule
- 30 minute ramp to 175°C + 15 minutes @ 175°C