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LOCTITE® ABLESTIK ATB F150E High Modulus non conductive die Attach Film is a 2-in-1 (“precut”) format designed for Small Die applications like DFN, QFN, MLP, SOIC and Sensors moving to thin wafer (<100um). It has a low CTE of 37 ppm, high Tg of 215°C and bulk thermal conductivity of ~0.6 W/mK and is formulated for use in wafer lamination and chip on chip processes or as a preform decal. It is good for thin die pickup and wire penetration and excellent for various filler sizes ranging from 25 to 75um depending on the film thickness. An interesting tidbit is that when you want to reach higher thicknesses, that don't exist in the product portfolio, you can stack 2 layers of a film to get to the desired thickness
LOCTITE® ABLESTIK ATB F150E adhesive film has a thickness of 50um but it is also available in 25 and 75um. The single layer 50um die attach film on special UV dicing tape is suitable for die size range from 0.3x0.3mm to 3x3mm. It performs excellently for die pickup without die fly and re-attach down to 0.3mm die size and for fast die placement (30-100ms) up to 9 months after lamination. Additionally it passes MSL1 up to 2x2mm die.