LOCTITE ABLESTIK CDF 200

Harmonization Code : 7115.90.00.00 | Other articles of precious metal or of metal clad with precious metal : Other

Main features

High MSL reliability
No resin bleed out
15um and 30um

Product Description

LOCTITE ABLESTIK CDF 200 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm . This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes

LOCTITE ABLESTIK CDF 200 offers high MSL reliability, controlled fillet size and does not exhibit resin bleed out. It has good wetting and low warpage on multiple die sizes and is recommended for thin wafer handling applications. It comes in 15 and 30um and is typically used for QFN, SOIC and SO package applications.

Cure Schedule

30 minute ramp from 25°C to 200°C, hold 60 minutes @ 200°C
30 minute ramp from 25°C to 175°C, hold 60 minutes @ 175°C

Specifications
Additional Information

Technical Specifications

General Properties

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	365 days

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	48 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	119 ppm/°C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

15 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

2.3 W/m.K

Additional Information

Films work like the “household double sided tape”. We can quickly appreciate the benefit as we used a dry resin for this, that results in a no mess assembly and very even BLT. Standard thickness of our films is 15um and 30um.

If your Z-space is really critical and has to have a very low BLT, Film is the way to go. Yes, there will be the additional process of laminating the film underneath you wafers but after that its all the same as traditional die attach process.