LOCTITE ABLESTIK QMI9507-2C2
- Controlled bondline thickness
- High thermal conductivity
- Stable at high temperatures
LOCTITE ABLESTIK QMI9507-2C2 is developed as a soft solder alternative for applications requiring high thermal or high electrical conductivity. It contains spacers for improved bondline control. The optimized loading percentage is such that other bulk properties of the material remain unaffected. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.
LOCTITE ABLESTIK QMI9507-2C2 has a proprietary hybrid chemistry that can be heat cured or snap cured. It's spacer size is ~50um and is typically used for the attachment of intergrated circuits and components to metallic leadframes. It can be used on a wide variety of substrates such as metals, Ceramic surfaces, Copper, Ni/Pd/Au, Alloy 42 leadframes and Silver-plated copper leadframes.
LOCTITE ABLESTIK QMI9507-2C2 is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.
- 30 minutes @ 185°C
- 7-Zone Oven:
- Temp per zone: 170ºC, 170ºC, 170ºC, 190ºC, 190ºC, 190ºC, 190ºC
- Time per zone, seconds 10
| Specific Gravity |
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
| Work life @25°C |
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
| Thixotropic index |
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.
A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.
It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
| Viscosity |
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
| Thermal Conductivity |
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.