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This Pull tab adhesion design is being used by epoxy molding manufacturers and companies around the world to test Epoxy molding compound adhesive properties. It is an easy and cost effective way to test epoxy properties "in house" and without the need for expensive and redundant machinery.
The leadframes are produced by chemical etching and come in a variety of Platings ranging from Bare Copper, to NiPd, PPF and Ag. Bare Copper is based on the C194 alloy and the bare thickness is ±0.10 inches with a ±0.0002 tolerance.
The leadframe design consists of 8 test units per strip. Each unit is approximately 1.24 x 0.9 inches.