PTLF | Pull Tab Adhesion Leadframe
Harmonization Code : 8541900000 | Semiconductor devices (for example, diodes, transistors, semiconductor-based transducers); photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED), whether or not assembled with other light-emitting diodes (LED); mounted piezo-electric crystals -Pa
Main features
- Pull tab adhesion design
- 8 units per strip
- Various platings
Product Description
This Pull tab adhesion design is being used by epoxy molding manufacturers and companies around the world to test Epoxy molding compound adhesive properties. It is an easy and cost effective way to test epoxy properties "in house" and without the need for expensive and redundant machinery.
The leadframes are produced by chemical etching and come in a variety of Platings ranging from Bare Copper, to NiPd, PPF and Ag. Bare Copper is based on the C194 alloy and the bare thickness is ±0.010 inches with a ±0.0002 tolerance.
The leadframe design consists of 8 test units per strip. Each unit is approximately 1.24 x 0.9 inches.
Different platings are being used to enhance the leadframe properties.