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Smart Cards

Wire Bonded

Wire Bonded

Wirebonded smart card modules are typically going through the following process:

  1. Dispense die attach
  2. Place die on the substrate and Heat Cure
  3. Wire bonding
  4. Apply encapsulant and Cure (Heat or UV)
  5. Dimensions and position of Encapsulant

 

Die attach

Conductive

  • 2030SCR
  • 2030SC

Non conductive

  • 2035SCR
  • ABP2501
  • 2033C

 

Encapsulation

Heat Cure

  • Dam
    • FP4451TD -
    • FP4451 
  • Fill
    • FP4450HF
  • Glob Top
    • EO1016
    • EO7021

 

UV Cure

  • Dam
    • -
  • Fill
    • UV8800M-X
  • Glob Top
    • UV8800M-X