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Hysol GR510 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Hysol GR510 | Black Epoxy Mold Compound
Hysol GR510 | Black Epoxy Mold Compound
GR510 Black Epoxy Mold Compound
GR 510 semiconductor epoxy molding mini-pellets QFP package
Hysol GR510 | Black Epoxy Mold Compound
GR510 Black Epoxy Mold Compound
Main features
  • High filler loading
  • Ultra low CTE of 8 ppm/°C
  • Designed for Quad Flat Pack (QFP) devices

Product Description

Hysol GR510 is a black, ultra-low CTE, transfer molded semiconductor epoxy molding compound designed for thin and larger quad flat pack (QFP) and larger small outline transistor (SOT) packages . Once transfer molded and post-mold cured, it has a very low CTE, low moisture absorption and high adhesion to a range of leadframe types. This allows it to acheive very high reliability levels for quad flat pack devices, but also for a range of larger SOIC packages.

Hysol GR510 has an ultra low coefficient of thermal expansion (CTE) of 8 ppm/°C that makes it one of the lowest stress materials avaiable in an epoxy molding compound. This low CTE comes from a technical breakthrough in filler size, filler type and filler loading. It has been successfully used for the production of printer heads from industry leading companies.

Hysol GR510 is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on quad flat pack devices and other, larger small outline packages including SOT, SOD and SMX package types. Hysol GR510 meets UL 94 V-0 Flammability at 1/8 inch (3.175mm) thickness.

Product Family
GR510 Black  
15 kg
Pellet Powder
N/A mm 25 mm
N/A gr 18 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Black
Filler Content 88 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.99
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 183 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 5.9 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 3.5 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 24h @ PCT 0.21 %
Mechanical Properties
Water Extract Data
Water Extract Data
Water Extract Data, 20hrs water boil
Conductivity 20 mmhos/cm
pH of extract 4.1
Flexural Modulus
Flexural Modulus @ 25°C 21,287 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 162 N/mm2
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds 81
Storage (DMA) Modulus
Storage (DMA) Modulus @ 175°C 844 N/mm2
Storage (DMA) Modulus @ 25°C 24,643 N/mm2
Storage (DMA) Modulus @ 260°C 717 N/mm2
Electrical Properties
Dielectric Constant
Dielectric Constant
Dielectric Constant (k), commonly known as relative permittivity, is a number relating the ability of a material to carry alternating current to the ability of vacuum to carry alternating current.

It determines the ability of an insulator to store electrical energy and is the ratio of electric permeability in vacuum against the electric permeability of a material.

The lower the dielectric constant (κ) and dissipation factor, the less energy is absorbed from an electric field, making it a much better insulator.

It is a dimensionless property that can be affected by various factors such as the
thickness uniformity of a material, insufficient contact between the sample and electrodes, water adsorption and contact resistance.
Dielectric Constant @ 1000 kHz 3.8
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 3.0x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 27 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 36 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 113 °C
Loss modulus peak @ DMA 111
Tan δ peak @ DMA 119
Spiral Flow
Spiral Flow @ 175°C 111.8 cm
UL94 Rating
UL94 @ 1/8 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F 70 - 120 s
Mold Temperature 170 - 190 °C
Preheat Temperature 70 - 90 °C
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 5 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs