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Hysol GR510 is a black, ultra-low CTE, transfer molded semiconductor epoxy molding compound designed for thin and larger quad flat pack (QFP) and larger small outline transistor (SOT) packages . Once transfer molded and post-mold cured, it has a very low CTE, low moisture absorption and high adhesion to a range of leadframe types. This allows it to acheive very high reliability levels for quad flat pack devices, but also for a range of larger SOIC packages.
Hysol GR510 has an ultra low coefficient of thermal expansion (CTE) of 8 ppm/°C that makes it one of the lowest stress materials avaiable in an epoxy molding compound. This low CTE comes from a technical breakthrough in filler size, filler type and filler loading. It has been successfully used for the production of printer heads from industry leading companies.
Hysol GR510 is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on quad flat pack devices and other, larger small outline packages including SOT, SOD and SMX package types. Hysol GR510 meets UL 94 V-0 Flammability at 1/8 inch (3.175mm) thickness.