Hysol GR510 | Black Epoxy Mold Compound
- High filler loading
- Ultra low CTE of 8 ppm/°C
- Designed for Quad Flat Pack (QFP) devices
Hysol GR510 is a black, ultra-low CTE, transfer molded semiconductor epoxy molding compound designed for thin and larger quad flat pack (QFP) and larger small outline transistor (SOT) packages . Once transfer molded and post-mold cured, it has a very low CTE, low moisture absorption and high adhesion to a range of leadframe types. This allows it to acheive very high reliability levels for quad flat pack devices, but also for a range of larger SOIC packages.
Hysol GR510 has an ultra low coefficient of thermal expansion (CTE) of 8 ppm/°C that makes it one of the lowest stress materials avaiable in an epoxy molding compound. This low CTE comes from a technical breakthrough in filler size, filler type and filler loading. It has been successfully used for the production of printer heads from industry leading companies.
Hysol GR510 is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on quad flat pack devices and other, larger small outline packages including SOT, SOD and SMX package types. Hysol GR510 meets UL 94 V-0 Flammability at 1/8 inch (3.175mm) thickness.
| Color |
|Filler Content||88 %|
| Specific Gravity |
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
|Spiral Flow @ 175°C||111.8 cm|
|Moisture absorption||0.21 %|
| Volume Resistivity |
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
|Loss modulus peak @ DMA||111|
|Tan δ peak @ DMA||119|
| UL 94 Rating |
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.
HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
|Transfer Pressure||40 - 85 kg/cm2|
|Transfer Time||5 - 15 s|
GR510 is a product that can replace GR828-FC1 for power SOTs. FC initials might remind you of Fairchild. Fairchild has been acquired by Onsemi in 2017 so their products still live on.