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Hysol GR700 C3D, also known as GR700-FM, is a halogen free, black, silica filled (87% filler weight) semiconductor grade epoxy molding compound. This low stress, high adhesion compound has very good electrical performance and is a proven, commercially available product code.
Hysol GR700 C3D is a technologically advanced, halogen free, green epoxy molding compound with excellent electrical performance, designed for high power devices applications with low moisture absorption requirements. Typical use can be in TO, SOIC, TSOP, QFP and PQFN semiconductor packages. Furthermore, it meets UL 94 V-0 flammability at 1/8 inch thickness.