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Hysol KL-3000FF is a black, semiconductor grade, high productivity molding compound, providing low stress and high reliability. It is 74% filled and achieves a flammability rating of V0 at UL94 testing conditions.
Hysol KL-3000FF is an environmentally friendly molding compound with high moldability that has a low coefficient of thermal expansion (18ppm/°C). It is typically used for SOD, KBU,GBU and DIP semiconductor packages.